Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Thyssenkrupp Drauz Nothelfer Gmbh

Thyssen Laser-technik Gmbh

Scansonic Mi Gmbh

Carl Cloos Schweisstechnik Gmbh

Peter Abels

Wolfgang Schulz

Eckhard Beyer

Stefan Kaierle

Jan Michel

Christian Kratzsch

Gerhard Alber

Dirk Petring

Boris Regaard

Friedrich Behr

Alexander J Drenker

Jorg Beersiek

Gerd Harzinger

Holger Nitsch

Dora Maischner

Michael Ungers

Jörg Neubert

Anas Moalem

Christoph Franz

Daniel Meyer

Ulrich Thombansen

Sebastian Krämer

Alexander Drenker

Wolfgang Fiedler

Christian Paul

The present invention relates to a method for measuring phase boundaries of a material during the machining of a workpiece () with a machining beam, more preferably with a laser beam, and a device that is embodied in such a way as to carry out the method. According to said method, during the machining, a machining region () containing the impact point of the machining beam () on the workpiece () is illuminated at least approximately coaxially to the machining beam () by means of additional optical radiation (). Radiation () reflected by the machining region () is detected, parallel to an incidence direction of the optical radiation () or at small angle thereto, by means of an optical detector with local resolution, in order to obtain an optical reflection pattern of the machining region (). From the optical reflection pattern, a course of at least one liquid/solid phase boundary in the machining region () is then determined in an automated manner by means of an image processing algorithm on the basis of a transition from an area containing a large-surface homogeneous area and an area containing a plurality of small-surface homogeneous areas in the optical reflection pattern.

Method for measuring phase boundaries of a material during machining with a machining beam using additional illumination radiation and an automated image processing algorithm, and associated device

In a method for cutting structural components to be joined by laser radiation that is guided by a computer-controlled manipulation system provided with a nominal path for each structural component corresponding to a joining line that is curved as a result of at least one of the structural components being three-dimensionally shaped, the structural component surfaces of the structural components including the joining line are determined measuring technologically. Based on measuring results, the nominal path corresponding to a penetration line of the structural components to be joined is calculated. A marking is formed on a first one of the structural component surfaces. When performing the cut on the structural component surface provided with the marking, the resulting cutting gap and the marking are determining measuring technologically. When a deviation of the cutting gap from the nominal path is detected, the manipulation system is controlled to correct the deviation.

Method for laser-cutting structural components to be joined

A method for materials processing by means of plasma-inducing high-energy radiation, especially laser radiation, in which the instantaneous intensity of the plasma radiation is measured at plural locations of a vapor capillary. So that the method can also be performed with perfect welding results on workpieces of very small thickness, shapes of two spaced-apart peak intensity regions, or of another type of electromagnetic radiation emitted from the vapor capillary, and of a minimum region that can be formed between these two regions of extreme values are detected metrologically, the so detected shapes of the regions of extreme values are compared with predetermined region shapes, and control of the materials processing operation takes place as a function of deviations of the detected shapes from the predetermined region shapes.

Method for shaping materials with plasma-inducing high-energy radiation

A method for processing workpieces by means of high-energy radiation, wherein the radiation is focused by a processing optic onto a processing site. The light radiation emanating form the workpiece is received by the same processing optic and is analyzed by a detector. An optical measurement with respect to the surface of the workpiece is performed in a processing area of the workpiece by means of an external source of measuring light, utilizing measuring light reflected from the processing area. The same processing optic is used to focus radiation onto the processing site and to receive radiation emanating from the workpiece at the processing site.

Method and device for machining workpieces using high-energy radiation

Method and device for working materials using plasma-inducing laser

Method of and apparatus for machining workpieces with a laser beam

Process and an arrangement for treating workpiece by means of laser

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Alsdorf, Germany

Peter Abels