Honeywell International Inc.

Peter A Schelonka

Joel D Stolfus

Wayne A Lamb

Lawrence E Frazee

Dennis R Grabowski

Scott E Michelhaugh

John S Patin

A DIN rail mounted device that may be mounted to a DIN rail with minimal components and without requiring the use of tools. In some instances, an electrical device is provided that has one or more integrally formed rigid latches and one or more integrally formed flexible latches. The electrical device may be secured to a DIN rail by first engaging the rigid latches along an upper edge of the DIN rail, and then rotating the device downwards to engage the flexible latches along a lower edge of the DIN rail. The electrical device may be removed by pushing the device upwards, thereby bending the flexible latches downward to a degree where the rigid latches disengage the upper edge of the DIN rail, and then rotating the device forward and down. The flexible latches may be adapted to compress sufficiently to permit this downward travel, and a recess or other opening may be provided behind the flexible latches to allow such movement.

DIN rail mount

A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

Chip on lead frame for small package speed sensor

A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy and/or solder can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

Thermoplastic overmolding for small package turbocharger speed sensor

A method and system for orienting and calibrating a magnet for use with a speed sensor. A magnet can be mapped two or more planes thereof in order to locate the magnet accurately relative to one or more magnetoresistive elements maintained within a speed sensor housing. An optical location of the magnet with respect to the magnetoresistive element and the sensor housing can then be identified in response to mapping of the magnet. Thereafter, the magnet can be bonded to the speed sensor housing in order to implement a speed sensor thereof maintained by the speed sensor housing for use in speed detection operations.

Growing community of inventors

Plymouth, MN, United States of America

Peter A Schelonka