Ormet Circuits, Inc.

Peter A Matturi

Catherine A Shearer

Michael C Matthews

Eunsook Barber

Richard Weaver

Sintering die-attach materials provide a lead-free solution for semiconductor packages with superior electrical, thermal and mechanical performance to prior art alternatives. Wafer-applied sintering materials form a metallurgical bond to both semiconductor die and adherends as well as throughout the die-attach joint and do not remelt at the original process temperature. Application to either one or both sides of the wafer, as well as paste a film application are disclosed.

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Del Mar, CA, United States of America

Peter A Matturi