International Business Machines Corporation

Peter A Engel

James R Petrozello

Douglas H Strope

Thomas E Wray

Steven R Shinners

John S Beaudry, Jr

In a circuit package having a connector for connecting a pin array circuit module and a printed circuit board, the connector is a molded plastic planar member with a plurality of openings extending through the member. In each opening, the member has two integral and spaced first and second parts having respectively oppositely aligned faces for receiving therebetween one of the pins. At least one of the parts resiliently extends across the opening, and at least one of the faces is a contact surface which mates with a pin of the module. A conductive layer with a predetermined circuit pattern is disposed on the member and includes conductors which extend from the contact surface to terminals disposed on the bottom surface of the member. The terminals are mateable with the input/output pads of the board. The member is disposed between the board and the module to provide the connection between the module and the board with the terminals of the member and the pads of the board being in contacting relationship. The pins of the module are disposed in the openings from the opposite surface of the member and each pin is extended and engaged by and between the respective faces of the paired parts in the particular opening in which the pin is inserted.

Connector and circuit package apparatus for pin array circuit module and

A displacement compensating module is disclosed wherein a blocking article, such as a polyimide tape, is disposed between an epoxy composition and the back surface of a substrate and between the epoxy composition and the inner surface of a cap for blocking the movement of the epoxy composition into a gap area during the manufacture of the module. An electronic module comprises a substrate, an integrated circuit chip disposed on the substrate, a cap disposed over and enclosing the chip and the substrate, a heat dissipator disposed between the cap and the chip for carrying away the heat dissipated by the chip, and an epoxy composition secured to the back surface of the substrate for sealing the module, and specifically, the chip within the module from harmful external influences. The boundary of a gap is defined by the edge of the substrate and the inner surface of the cap. A blocking article, such as a polyimide tape, is disposed between the epoxy composition on one side and the back side of the substrate coupled with the inner surface of the cap on the other side for holding the epoxy composition external to the gap and preventing the epoxy composition from being disposed within the gap during the manufacture of the module. As a result, the cap is relatively free to move with respect to the substrate. Unnecessary distortion of the cap is minimized and resultant damage to the chips within the cap is avoided.

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Vestal, NY, United States of America

Peter A Engel