Apple Inc.

Peter A Dvorak

Cesar Lozano Villarreal

Alexander Michael Kwan

Siri Amrit Ramos

Ross C Heyman

Xuyang Zhang

Michael A Foote

Christopher J Pawlowski

Hao Xu

Yiren Wang

Han Wang

Eric W Bates

Arun R Varma

Yuan Tao

Mathieu P Roy

Ana Papio Toda

Ciaran Keane

Ronald Lam

Jeremy M Dahl

Brian K Thorne

Jack R Lanzi

Joshua K Anderson

An electronic device may be provided with a liquid crystal polymer (LCP) printed circuit having conductive trace and a hole. A conductive flange may be soldered to the conductive trace and may extend into the hole. The end of the conductive flange may laterally surround a central opening within the hole. A conductive contact may be inserted into the central opening. Solder may be deposited over the conductive flange and in the central opening. The solder may couple the conductive contact to the conductive flange and thus the conductive trace. This may ensure a robust mechanical and electrical connection between the conductive contact and the conductive trace on the printed circuit despite the printed circuit being formed from LCP, which may not support copper-plated through vias for coupling to the conductive contact.

Electronic device having conductive contact soldered to printed circuit

A power adapter is disclosed. The power adapter includes housing parts that carries electronic components. To secure the housing parts together, one housing part includes snaps and another housing part includes protrusions and rails. During assembly, the protrusions slide under the snap, causing the snap to deflect in one direction, while the rails slide over the snap, which keeps the snap partially flat but also causes the snap to deflect in another direction. The engagement (during assembly) of the rails and the protrusions to opposing surfaces of the snap cause bi-directional deflection/bending of the snap. When each protrusion is positioned into an opening of the snap, the snap returns to a flat, non-deflected state, and the housing parts are secured together by the snap, protrusions, and rails. The rails support the snaps by limiting or preventing additional deflection of the snap, which subsequently promotes the housing remaining together.

Power adapter housing with snaps capable of bidirectional deflection

An enclosure for an electronic device includes a housing having wall defining a cavity that is configured to receive an electronic assembly therein. The wall includes a plurality of housing steps formed in an interior surface. A cap includes a side surface extending around a perimeter of the cap with a plurality of cap steps formed in the side surface. The cap is positioned at an entrance to the cavity such that the plurality of housing steps align with the plurality of cap steps and welded in place. Flash from the weld is captured in a flash trap so that no weld flash is visible on the exterior surface of the enclosure.

Ultrasonic weld joint with integral flash trap

An enclosure for an electronic device includes a housing having a wall that defines a cavity that is configured to receive an electronic assembly therein. The wall includes tongue formed at a distal end. A cover includes a top wall and a side surface extending from the top wall to form a chamber. The housing is at least partially received within the chamber and the tongue of the housing is welded to a groove positioned within the chamber. Flash from the weld is contained within the enclosure so that no weld flash is visible on the exterior surface of the enclosure.

Dual cup enclosure for electronic devices

An enclosure for an AC to DC adapter has a continuous and apparently seamless exterior surface. The enclosure includes a housing and a cap that are joined by a pair of weld joints. One weld is formed on an interior portion of the enclosure providing strength and one weld joint is formed on the exterior surface providing a seamless appearance for the enclosure.

Enclosures having a seamless appearance

An enclosure for an AC to DC adapter has a continuous and seamless exterior surface. The enclosure includes a housing and a front wall that are joined by a bonded interface. The front wall is formed from a metallic interface plate and an exterior layer of plastic that is formed over the metallic interface plate and bonded to the housing.

Molded enclosures having a seamless appearance

Growing community of inventors

Menlo Park, CA, United States of America

Peter A Dvorak