Intel Corporation

Other

Sanyo Denki Co., Ltd.

Peter A Davison

Michael T Crocker

Michael L Rutigliano

Michael R Stark

David J Llapitan

Thomas J Wong

Bill Lieska

Paul J Gwin

Rolf A Konstad

James S Webb

Ketan R Shah

Thomas G Ruttan

Neal E Ulen

Mike MacGregor

Kurt A Jenkins

Ed Stanford

Tony Harrison

Sabina J Houle

Bryce D Horine

Gary A Brist

John C Johnson

David Pidwerbecki

Brian J Long

Stephen H Hall, Jr

Tomoaki Ikeda

Masashi Miyazawa

Masayuki Iijima

Mark A Trautman

Ben M Broili

John G Oldendorf

Eric J Moret

Patrick S Johnson

Kouji Ueno

Lawrence M Palanuk

Gregory A Stone

Joseph A Benefield

David A Jones

Amol Kirtikar

Lee M Langseth

Joe Benefield

Alexis Ulmer

Michael June

John G Olendorf

Rolf Konstad

There may be provided a wafer support member which may include a support column and a plurality of wafer-engagement-shelves extending substantially perpendicularly to the support column from a first side of the support column. Each wafer-engagement-shelf may define a plurality of through-holes extending between a base surface and an opposite wafer-engagement surface of the wafer-engagement shelf. The plurality of through-holes may serve as discharge ports for a plurality of loose particulates on the wafer-engagement-shelf to exit therefrom via the discharge ports.

Wafer support member and method of manufacturing a wafer support member

There may be provided a connector for a liquid container. The connector may include a connector body, and a through-hole for fitting on a neck portion of the liquid container. The connector may further include a restraining arrangement positioned proximal to the through-hole. The restraining arrangement may include a first restraining member and a second restraining member extending towards a central axis of the connector body. The first restraining member may have a distal end that extends further than a distal end of the second restraining member. The distal end of the first restraining member may engage the neck portion of the liquid container at a first position, and the distal end of the second restraining member may engage the neck portion of the liquid container at a second position. The connector may further include a connector-to-key-interface arrangement configured to mate with a corresponding surface of a key member.

Connector and connection assembly

Systems and methods provide for a device including a film having a shape that defines an interior region. The device may also include one or more electronic components disposed within the interior region of the film, and a hardened thermo-set resin within the interior region, wherein the thermo-set resin encompasses the electronic components and substantially fills the interior region of the film. In one example, printed content is coupled to a surface of the film. In addition, the thermo-set resin may include an additive that is configured to absorb and distribute heat generated by the electronic components.

Film insert molding for device manufacture

A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Methods and devices for securing and transporting singulated die in high volume manufacturing

Techniques associated with higher performance barrier materials for containers to contain one or more environmentally sensitive devices associated with semiconductor manufacture are generally described. In one example, an apparatus includes an enclosure to contain one or more environmentally sensitive devices associated with semiconductor manufacture, the enclosure comprising a liquid crystal polymer (LCP) to provide a barrier against at least water and oxygen and to reduce purging requirements, and a door coupled with the enclosure.

Higher performance barrier materials for containers of environmentally sensitive semiconductor fabrication devices

Embodiments of a method and apparatus for imprinting a trench pattern on a substrate using ultrasonic vibrations. The trench pattern corresponds to a circuit pattern that is to be formed on the substrate, the circuit pattern including a number of conductive traces and other conductive elements. In one embodiment, the substrate includes a base layer and a layer of dielectric material overlying a surface of the base layer, and the circuit pattern is formed in the dielectric layer.

Method and apparatus for imprinting a circuit pattern using ultrasonic vibrations

A small water-cooling type electronic component cooling apparatus is provided. The electronic component cooling apparatus comprises a so-called water-cooling heat sink, a radiatorcooled by an electric fan, first and second coolant pathsfor circulating a coolant between the heat sinkand the radiator, and an electric pumpto supply a moving energy to the coolant. The electric pumpis arranged at a position facing the heat-radiating portion of the radiator

Electronic component cooling apparatus

In some embodiments, an electronic device comprises a circuit board, an antenna structure on the circuit board, and a waveguide mounted on the circuit board above the antenna structure. Other embodiments may be described.

Modular waveguide inteconnect

An injection molded metal bonding tray may be utilized in the fabrication of integrated circuit devices. In one embodiment, a substrate of an integrated circuit device is placed in a pocket of an injection molded metal bonding tray. A plurality of conductors is placed on the substrate and the conductors are bonded to the substrate in an infrared reflow oven, for example. Other embodiments are described and claimed.

Injection molded metal bonding tray for integrated circuit device fabrication

A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.

System and method for providing cooling systems with heat exchangers

A land grid array (LGA) socket is connected to a power converter using compression contact technology eliminating the need for an edge-card connector typically required in such applications. The LGA socket is mounted to the power converter in a single direction of assembly (i.e., the vertical axis).

System and method for connecting a power converter to a land grid array socket

Heat sink attachment components are provided comprising retention bolts with a coil spring captured between the head of the retention bolt and a retention lock flange of a retention lock. A portion of each retention bolt shaft is retained and in frictional engagement with socket bores of a mounting socket. A moderate interference fit between the retention lock and the retention bolt prevents unintended decoupling. While engaged, the compressed coil spring urges against the retention lock flange, with the retention lock flange in urging engagement with the heat dissipation side of a heat sink base, with the heat sink base in urging engagement with thermal interface material on the top of the microelectronic package. The urging engagement of the coil springs provide a constant bias for urging engagement between the components.

Heat sink attachment device

According to some embodiments, a cooling system that may be installed in a computer chassis has a fluid-containing space that is sealed and pressurized by an inert gas. The fluid-containing space may be formed from a cold plate that may serve as a heat sink for an integrated circuit, a heat exchanger, tubing, and a pump volume. A coolant may be contained in the fluid-containing space.

Sealed and pressurized liquid cooling system for microprocessor

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Sumner, WA, United States of America

Peter A Davison