Olin Corporation

Peter A Danna

Richard J Roethlein

Richard A Holcomb

Richard D Burt

An improved means for connecting anode posts and conductors to diaphragm cells is described which utilizes a conductor comprised of a pair of split and spaced-apart copper bars having a series of pairs of adjacent round grooves, each pair of grooves being adapted to receive an anode post. The pair of bars is firmly secured to the anode posts by bolting each pair of bars together. A laminated cell base is employed comprised of a non-metallic corrosion resistant upper layer, such as rubber, secured to a lower metallic supporting layer such as steel. Sealing means are provided between a dished washer on the anode post and the upper layer, and between the anode post and wall of the cell base hole in the lower layer.

Connection means for anode posts and conductors to electrolytic cells

A method of bonding film-forming metals and their alloys has been developed. The method comprises applying a first coating of a metal, compound, or alloy of the platinum metal group to the film-forming metal. A second coating of copper is then applied to the first coating. A second metal, such as steel, can then be readily soldered to the copper coating to form a strong, durable bond. This bonding method can be used, for example, to solder a titanium screen or mesh to an electroconductive metal in the assembly of electrolytic cells for the production of chlorine or oxychlorine compounds.

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Milford, CT, United States of America

Peter A Danna