International Business Machines Corporation

Peter A Burnett

Roy H Magnuson

Stephen L Tisdale

Ronald A Kaschak

Dae Young Jung

Robert G Rickert

Copper is deposited onto a substrate by plating a first layer of copper onto the substrate from an electroless plating bath and plating a second layer of copper onto the first layer of copper from a second and different electroless plating bath. The first and second plating baths differ from each other in at least the cyanide content. The process reduces plating void defects and reduces nodule formation.

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Endicott, NY, United States of America

Peter A Burnett