Mattson Technology, Inc

Beijing E-town Semiconductor Technology, Co., Ltd

Pete Lembesis

Michael Xiaoxuan Yang

Rolf Bremensdorfer

Joseph Cibere

Dieter Hezler

Dixit V Desai

Alex Wansidler

An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.

Workpiece processing apparatus with thermal processing systems

Workpiece processing apparatus with plasma and thermal processing systems

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Boulder Creek, CA, United States of America

Pete Lembesis