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Pertti Seväkivi

Markku Talja

Marjukka Mäkelä

Juhani Helosvuori

Jaani Kärppä

Niko Björkman

Mika Asikainen

Teemu Salmia

Hanna Rapinoja

Timo Väätäinen

Vesa Tiihonen

Juha Viljasalo

Petri Isaksson

Hermanni Tervo

A field of enclosures for electronics and electrical components within electric devices, such as electric drive devices for industrial applications, e.g. for working machine and marine applications, and more particularly to an electronics enclosure arrangement for an electric device, and to an electric device. The electronics enclosure arrangement according to the present invention is arranged for an electric device, the electric device including one or more circuit boards and electronics components assembled on the one or more circuit boards, wherein the electronics enclosure arrangement includes an electronics enclosure cover; and an at least one volume element part, arranged in the space between the electronics enclosure cover and the one or more circuit boards with the electronics components.

Electronics enclosure arrangement for an electric device and an electric device

A heat exchanger comprising a body part and a cooling fin system having an inlet end and an outlet end. The cooling fin system has a plurality of cooling fins, and is adapted to provide a flow path for a coolant flow through the cooling fin system in a longitudinal direction. The coolant flow is adapted to enter the cooling fin system through an inlet surface of the cooling fin system. The inlet surface of the cooling fin system is a non-planar surface.

Heat exchanger and cooled electrical assembly comprising ihe same

A cooling element comprising a cooling body, the cooling body comprising a first surface and a second surface, the first surface and the second surface being on the opposing sides of the body and the distance between the first and second surfaces defining the height of the cooling body, multiple of channels for cooling liquid arranged inside the cooling body, the channels extending in a longitudinal direction of the cooling body, wherein the channels are arranged in two layers in the direction of the height of the cooling body inside the cooling body and the cooling element is adapted to hold electronic components on the first surface and on the second surface for cooling electronic components on both surfaces.

Cooling element for electronic components and electronic device

A method and arrangement are disclosed for a vehicle inverter drive having a voltage distribution block and two or more inverters, intermediate circuits of which are connected in parallel to the voltage distribution block for supplying voltage to the intermediate circuits, in which the intermediate circuits of the inverters are interconnected with a coaxial cable to minimize inductance in the parallel connection.

Arrangement and method for a vehicle inverter drive

A capacitor fastening for fastening a capacitor to a panel, whereby the capacitor, when mounted in place, is positioned in the panel, fastened at its lower part. The capacitor fastening includes a retainer in the panel at the mounting point of the capacitor for preventing lateral movement of the capacitor in at least one selected direction; a tightening plate arranged above the panel and to be fastened to the panel, which tightening plate has a hole substantially corresponding to the diameter of the capacitor above the mounting point of the panel; and a wedge between the panel and the tightening plate for tightening the retainer of the panel and the edge of the hole in the tightening plate from opposite directions against the capacitor.

Capacitor fastening

Equipment for distribution of electric power

A coil includes electrically conductive winding wire wound in turns around a core in one or more layers. The surface of the winding wire is provided with at least one groove in the direction of the longitudinal axis of the winding wire, and at least one cooling tube which enables coolant circulation is positioned in the groove of the winding wire, being at least partly embedded therein. The groove is formed on the surface of the winding wire of an outermost winding wire layer relative to the core and opens away from the core The cooling tube in the groove is placed around the outermost winding wire layer and covers the outermost winding wire layer at least partly.

Method for manufacturing coil, and a coil

A cooling element for an electronic apparatus can include an inlet for receiving fluid, an outlet for forwarding fluid from the cooling element, and multiple pipes providing parallel fluid paths for passing the fluid from the inlet to the outlet. To obtain a simple and efficient cooling element, multiple base plates for receiving electronic components can be attached to the pipes for conducting heat generated by the electronic components to the fluid in the pipes.

Cooling element

A load control apparatus adapted to indirectly detect an overcurrent, i.e. a current magnitude exceeding a predetermined limit value, occurring in an electric conductor element () belonging to a load current circuit (), on the basis of an increase in temperature. The load control apparatus () comprises a control current circuit including a temperature-sensitive switch member (S) capable of changing its operational state in response to an increase in the temperature to a predetermined value, and a control unit () adapted to detect a change in the operational state of the temperature-sensitive switch member (S), and to detect an overcurrent occurring in the electric conductor element () based thereon, the temperature-sensitive switch member (S) being adapted to be connected heat-conductively to a target element, in which at least part of the load current of the electric conductor element () passes in an operating situation, and the temperature-sensitive switch member (S) being further adapted to be electrically insulated from the electric conductor element () of the load current circuit.

Load control apparatus

A method and assembly for mounting power electronics modules in an equipment cabinet, cubicle or other like equipment space. According to the invention, the power electronics modules are mounted in the equipment space () with the help of mounting bases (), such that the mounting bases () comprise fixture means () for fixing the mounting base in the equipment space () and a mounting plate () fixed supportedly by the fixture means () so that the first end of the mounting plate is situated closer to the fixture means () of the first end than the opposite end () of the mounting plate () from the fixture means () of this opposite end, whereby the mounting plate () becomes aligned in a slanted position in the equipment space.

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Lepsämä, Finland

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