Nokia Corporation

Pertti Ik&auml;l&auml;inen

Olli Salmela

Petri Savolainen

Markku Koivisto

Hans Somerma

Esa Kemppinen

The invention relates to structures, by which part of the incoming high-frequency energy can be separated to its own path (out ) or energies coming from different paths can be combined to a common path. The basic idea of the invention is that all components of the dividing or combining means are integrated into a monolithic structure in an insulating material, preferably multilayer ceramics. The transmission line strips ( ) and other conductors are formed by printing conductive material on the outer surface of the ceramic piece ( ) and in its interlayers, when required. The conductors between the surfaces are formed by filling the hole made through the layer or layers with conductive material. The resistive components ( ) parallel with and between the surfaces are formed in a similar manner. The structure according to the invention is relatively small and reliable, and its manufacturing costs are low.

Means for handling high-frequency energy

The invention is directed to a method for matching characteristic impedances in a wideband manner. The matching of characteristic impedances is realized by tapering a conductor inside a wall composed of a dielectric material. The tapered conductor is either an asymmetric stripline or an asymmetric coplanar line. The method enables characteristic impedance matching at up to 40 GHz. The coupler is applicable to signal line feedthroughs in MMIC packages.

Growing community of inventors

Huhmari, Finland

Pertti Ikäläinen

Growing community of inventors

Huhmari, Finland

Pertti Ik&auml;l&auml;inen

Pertti Ikäläinen