Cisco Technology, Inc.

Perry L Hayden

Vic Hong Chia

Gary Chan

Bob Dillman

Paul Matthew Plummer

Various implementations disclosed herein include a thermal management system suitable electronic devices. In some implementations, a thermal management system includes an air guide and a cage wall, which together provide: an air intake having a first airflow area to produce a first air pressure; an airflow constriction, following the air intake, having a second airflow area smaller than the first airflow area to produce a second air pressure, and defining a first region; and an outlet following the airflow constriction having a third airflow area greater than the second airflow area to produce a third air pressure. The device cage has at least one aperture in the first region. The second air pressure is less than the first air pressure and the third air pressure and is sufficiently low to draw heated air from within the device cage through the at least one aperture to be expelled through the outlet.

Thermal management system

Formation of a deformation along a surface of a sheet metal panel of an electronic device is minimized or prevented by determining an area of the surface to which a deformation has developed or is predicted to develop, where the deformation forms or is predicted to form in response to one or more of the surface features being provided into the surface. A score line is provided along the surface that is at or proximate the area.

Growing community of inventors

Magalia, CA, United States of America

Perry L Hayden