Other

Otb Group B.v.

Amic Ab and Gyros Ab

Per Ove &Ouml;hman

Lars Rune Lundbladh

Hans G&ouml;ran Evald Martin

Claes Lannart Eriksson

Lars Gustaf Magnus Bering

Rolf Tommy Nils Karlsson

Lars G&ouml;ran Eriksson

Method and device for heat treatment of a disc, whereby the disc ( ) is placed on a carrier ( ) after which the disc is irradiated. During the radiation the carrier is kept on a desired temperature. The desired temperature of the carrier is about the temperature of the disc prior to placement on the carrier. The disc comprises two disc elements and an adhesive layer between the disc elements, whereby the adhesive layer is cured by the irradiation with ultraviolet light.

Method and device for heat treatment of a disc

The invention relates to a method of producing a matrix suitable for use in a plastic element-producing machine, a matrix produced in accordance with the method and use of such a matrix to form a plastic element. One side of the matrix is provided with a negative microstructure which is replicated in plastic material to form a positive microstructure on a plastic element, wherewith the matrix can be produced by applying a layer of material to the positive microstructure side of a master. The positive microstructure side of the master has a thin wear-resistant layer which serves as a first wear surface, wherewith said layer will present irregularities which correspond essentially to the microstructure, and wherein at least said irregularities are filled-in with a plastic composite so as to form a carrier element for supporting the first wear layer. The layer can further be provided with means for supplying heat energy to said matrix.

Matrix, method of producing and using the matrix and machine including the matrix

The present invention relates to a method of producing an electric, electronic, electromechanical and/or mechanical component ( ), where the component substrate is given a three-dimensional structure ( &Prime;) or configuration, and where said substrate is adapted for further treatment or processing to form the component ( ). The substrate is formed by shaping said substrate against a die or mold, such as by molding, pressing, extruding or embossing said substrate, wherewith the precision necessary with respect to said component in the three-dimensional structure is achieved by means of a micromechanical working process when producing the die or mold.

Method of component manufacture

Growing community of inventors

Uppsala, Sweden

Per Ove Öhman

Growing community of inventors

Uppsala, Sweden

Per Ove &Ouml;hman

Per Ove Öhman