Telefonaktiebolaget Lm Ericsson (publ)

Per Ingelhag

Magnus Nilsson

Peter Jakobsson

Peter Melin

Sten Wallin

Agneta Ljungbro

Mingquan Bao

Torsten John Carlsson

Anatoli Deleniv

Martin Isberg

Dandan Hao

Bengt Erik Jonsson

David Gustafsson

Joakim Plahn

Peter Svensson

Björn Olsson

Örjan Renström

Emil Nylander

Björn Albinsson

Fredrik Larsson

Anders Aronsson

An electrical component assembly () comprising a heat sink (), electrical components (--) arranged on the heat sink () and an interconnect () electrically connecting the electrical components (--). The heat sink () is integrated with the electrical interconnect () such that the electrical interconnect () is at least partly arranged in and extends along a cavity () of the heat sink (). The electrical interconnect () comprises at least one layer () of deposited material comprising electrically conductive material forming one or more interconnecting conductors (). The interconnect further comprises one or more dielectric layers () of deposited material which isolate the one or more interconnecting conductors (). The one or more interconnecting conductors () electrically contacts the respective electrical component in a respective contact area (-) of the cavity (). The electrical components (--) are arranged on the heat sink () such that a respective one of one or more electrical contacts (-) of the electrical components align with a respective interconnecting conductor ().

Electronic component assembly, an antenna array system, and electronic device, and a method for manufacturing an electrical component assembly

The present disclosure relates to a balun arrangement () comprising a slot () at least partially having a crossing slot width (ws, hs) running between a first longitudinal side () and a second longitudinal side () in at least a first metallization layer (). The balun arrangement () further comprises an unbalanced first port (P) that is defined between a first connection () to the second side () of the slot () and a fourth connection () to the first side () of the slot () and a balanced second port (P) that is that is defined between a second connection () to the second side () of the slot () and a fifth connection () to the first side () of the slot (). The balun arrangement () also comprises a balanced third port (P) that is defined between a third connection () to the first side () of the slot () and a sixth connection () to the second side () of the slot ().

Wideband balun arrangement

In an example embodiment, a system comprises a chain of serially coupled nodes, including a central processing node (CPN) and one or more radio communications nodes (RCNs). The CPN couples to a first RCN in the chain via a dielectric waveguide (DWG) link and any further RCNs in the chain are successively connected in serial fashion from the first RCN via further (DWG) links. The CPN generates outbound radio carrier signals that are waveguide-propagated in a downstream direction of the chain, for over-the-air (OTA) by targeted ones of the RCNs, while radio carrier signals received via OTA reception by respective ones of the RCNs are waveguide propagated as inbound radio signals in an upstream direction of the chain, for processing by the CPN. Advantages from he contemplated system include greatly simplified implementation of the RCNs, with lower cost and power consumption. Further, strategic placement of failover CPNs and DWG links provide for continued operation in the face of CPN or DWG link failures.

Method and apparatus for radio communications

The present disclosure relates to a waveguide arrangement including a mounting printed circuit board, PCB, and at least a first waveguide layer. Each waveguide layer comprises at least a first waveguide conducting tube, each waveguide conducting tube having an electrically conducting inner wall. The PCB includes a signal interface for each waveguide conducting tube. The waveguide arrangement further includes at least a first coupling layer that is positioned between the PCB and the first waveguide conducting tube such that at least the first waveguide conducting tube of the first waveguide layer is connected to the corresponding signal interface via the first coupling layer.

Cooling in a waveguide arrangement

Methods for determining calibration parameters to correct for frequency responses of one or more dielectric waveguides coupling a control unit to a first antenna node or to a series of antenna nodes that includes the first antenna node. An example method comprises transmitting, via a first dielectric waveguide coupling the control unit to the first antenna node, a radiofrequency (RF) test signal having a signal bandwidth covering a bandwidth of interest. The method further comprises receiving, via a second dielectric waveguide coupling the control unit to the first antenna node, a looped-back version of the transmitted RF test signal, and estimating a first one-way frequency response corresponding to the first (or second) dielectric waveguide, based on the RF test signal and the received loop-back version of the transmitted RF test signal.

Dielectric waveguide signal transfer function compensation

The present invention relates to a carrier substrate () comprising signal vias () for electrically interconnecting components () arranged on opposing sides of the carrier substrate (). The carrier substrate () further comprises: at least one cavity () embedded in the carrier substrate () having at least one chamber wick part () and a working fluid, and wherein the at least one cavity () at least partially encompass the signal vias (). The present invention also relates to an electronic assembly and an apparatus for wireless communication comprising the carrier substrate ().

Carrier substrate, an electronic assembly and an apparatus for wireless communication

A first aspect provides in a supply voltage control module, a method of providing instructions for setting a supply voltage comprising obtaining information on a supply voltage need of a load and based on that information, determining a supply voltage that is to be provided to the load. Subsequently, an instruction is sent to a power supply module to supply the determined supply voltage to the load. A need for a supply voltage of a load, like an integrated circuit, may not only depend on design of the load, but also on parameters of the manufacturing process and the level of activity of the load. By obtaining information on a supply voltage need of the load and using that information to determine a supply voltage to be provided to the load, a feedback loop is created by instructing a point of load power supply to provide the supply voltage determined.

Method and module for providing instructions for setting a supply voltage

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Alingsås, Sweden

Per Ingelhag