Micronic Laser Systems Ab

Climeon Ab

Mycronic Ab

Micronic Mydata Ab

Micronic Ab

Per Askebjer

Torbjörn Sandström

Mats Rosling

Joachim Karthäuser

Robert Eklund

Jonathan Walford

Torbjorn E Sandstrom

Peter Ekberg

Esko Ahlbom

Mats Ekberg

Thomas Öström

Kari Munukka

Anders Thuren

Magnus Genrup

Olle Bergström

Hans Fosshaug

The technology disclosed relates to accommodating embedded substrates during direct writing onto a printed circuit board and to other patterning problems that benefit from an extended depth of focus. In particular, it relates to multi-focus direct writing of a workpiece by the continuous or step-wise movement of the workpiece during the sequence of exposures having different focus planes. In one implementation, a multi-arm rotating direct writer is configured for interleaved writing focused on two or more focal planes that generally correspond to two or more surface heights of a radiation sensitive layer that overlays the uneven workpiece. Alternating arms can produce interleaved writing to the two or more focal planes.

System for direct writing on an uneven surface of a workpiece that is covered with a radiation sensitive layer using exposures having different focal planes

A heat recovery system arranged to be used together with a first closed loop system (S) configured as a first closed-loop thermodynamic Rankine cycle system, to convert heat from a heat generating unit () into electrical energy (E). Said heat recovery system comprising a second closed loop system (S) comprising a second system working medium (W) configured as a second closed-loop thermodynamic Rankine cycle system arranged to convert the heat in at least one heat stream (HS) generated by the heat generating unit () into a first batch (E) of electrical energy (E) and a third closed loop system (S) comprising a circulating third system working medium (W). In the second closed-loop thermodynamic Rankine cycle system the condensation heat enthalpy of a vaporised second working medium (W) is transferred to said third system working medium (W) and the heat from the third system working medium (W) is used as an initial thermal input to the second closed loop system (S), thus converting heat from the third system working medium (W) into a second batch (E) of electrical energy (E). The invention also relates to a method to use a heat recovery system together with a first closed loop system configured as a first closed-loop thermodynamic Rankine cycle system, to convert heat from a heat generating unit into electrical energy.

Heat recovery system and a method using a heat recovery system to convert heat into electrical energy

Maskless writing of a workpiece using a plurality of exposures having different focal planes using multiple DMDs

Expansion machines in thermodynamic cycles operate at low pressures, i.e. below 10 bar. The interplay among components including gas generator, expansion machine, heat exchangers and pressure reduction device (absorber or condenser) is optimized, resulting in configurations operating at the lowest achievable cost level. A single stage radial turbine characterized by a pressure ratio of 5-10, a dimensionless speed of about 0.7 and a loading coefficient of 0.7 is a preferred expansion machine for certain thermodynamic cycles involving CO2 gas to permit such radial turbines to operate close to their optimum design specification and highest efficiency level. Methods to handle liquids which may condense within or inside the turbine are also disclosed, as well as methods to handle axial pressure on bearings and methods to protect lubricant in bearings.

Thermodynamic cycle operating at low pressure using a radial turbine

The present invention relates to a reconfigurable micro-mechanical light modulator including a two-dimensional array of modulating elements with redundant rows of modulating elements. In particular, it relates to extending the life of the modulator by shifting the set of elements used, without physically replacing the micro-mechanical light modulator. The modulating elements are adapted to modulate light impinging on the micro-mechanical light modulator. The array of modulating elements comprises a first and a second set of modulating elements. The second set is a redundant set of modulating elements that can be selected to substitute for the first set of modulating elements in modulating light impinging on the micro-mechanical light modulator, without physically replacing the micro-mechanical light modulator. Devices and methods are described.

Oversized micro-mechanical light modulator with redundant elements, device and method

The technology disclosed relates to translating between a Cartesian grid and a curved scanning path that produces varying exposure doses as the scanning head traces the curved scanning path. It can be applied to writing to or reading from a workpiece. In particular, we teach use of varying exposure dose that compensates for the time it takes for the curved scan path to transit a straight axis. This simplifies either modulation of a modulator, from which data is projected onto the workpiece, or analysis of data collected by a detector, onto which partial images of the workpiece are projected.

Rotor optics imaging method and system with variable dose during sweep

The present invention describes a micro-mechanical light modulator including a two-dimensional array of modulating elements, in which small modulating elements are organized into larger modulating areas. Using smaller elements organized into larger areas increases the resonant frequency of the modulators and the modulation speed. In some implementations, multiple modulating elements are driven by shared signals, allowing the number of elements driven and the resulting area to increase without increasing the data traffic. In some implementations, an anamorphic optical path is used that leaves individual modulating elements of the micro-mechanical light modulator that are operated as a single area unresolved at an image plane of the workpiece being patterned. Devices and methods are described.

SLM device and method combining multiple mirrors for high-power delivery

An aspect of the present invention includes a method of lithography to enhance uniformity of critical dimensions of features patterned onto a workpiece. Said workpiece is coated with a coating sensitive to electromagnetic radiation. An electromagnetic radiation source having an illumination intensity is provided. At least one object pixel of electromagnetic radiation is created. A predetermined pattern is exposed, by using said at least one object pixel, on at least a portion of said workpiece in a first exposure pass with a first dose to provide less than full exposure of said coating sensitive to electromagnetic radiation. Said exposing action is repeated at least until said portion of said coating sensitive to electromagnetic radiation is fully exposed, wherein said dose is increased for every following pass. Said fully exposed coating sensitive to electromagnetic radiation is developed.

Method to pattern a substrate

The present invention relates to methods for patterning substrates, such as reticles, masks or wafers, which reduce critical dimension variations, improving CD uniformity. In particular, it relates to tuning doses applied in passes of a multipass writing strategy to measurable characteristics of resists or radiation sensitive layers applied to the substrates. Particular writing strategies are described. Aspects of the present invention are described in the claims, specification and drawings.

Further method to pattern a substrate

The present invention relates to a method and a system for predicting and correcting geometrical errors in lithography using masks, such as large-area photomasks or reticles, and exposure stations, such as wafer steppers or projection aligners, printing the pattern of said masks on a workpiece, such as a display panel or a semi-conductor wafer. The method according to the invention comprises the steps of collecting information about a mask substrate, a mask writer, an exposure stati n, and/or about behavior of a processing step that will occur after the writing of the mask. Further the method comprises predicting from the combined information distorsions occuring in the pattern, when it is subsequently printed on the workpiece; calculating from said prediction a correction to diminish said predicted distorsion, and exposing said pattern onto said mask substrate while applying said correction for said distorsions.

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Åkersberga, Sweden

Per Askebjer