Thomas West, Inc.

Lsi Logic Corporation

Pepito Galvez

Thomas E West

Peter McKeever

Gary Quigley

Suli Holani

Long Van Nguyen

Samuel Vance Dunton

Kevin H Song

Ron J Nagahara

Matt Richardson

Koli Holani

Jorge Craik

A method and systems for controlling optical transmissivity of a polish pad material are provided. The method and systems may include adjusting control parameters to determine the optical transmissivity of a polish pad material. The control parameters may also include pre-processing controls, casting controls, and/or curing controls. Methods and systems also provided for assembling a polish pad that controls the optical transmissivity of the polish pad. Additionally, a polish pad with a controlled optical transmissivity is provided.

Method and systems to control optical transmissivity of a polish pad material

A method for making a multilayer polishing pad includes rotating a cylinder about a central axis. The cylinder encloses in an interior space a single polymer mixture that phase separates under centrifugal force. The method also includes forming the polishing pad from at least some of a polymer formed after the polymer mixture has reacted. The method includes forming at least two distinct layers in the polishing pad by casting and gelling sequentially at least two different polymers.

Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads

A method of testing the processing of a wafer on a CMP apparatus includes processing a control wafer with the CMP apparatus with a predetermined control consumable combination under a predetermined set of control conditions and generating a control data set which describes the processing of the control wafer with the CMP apparatus, the control data set being based upon the control conditions and a removable rate of the control wafer. The method further includes processing a test wafer with a CMP apparatus with a test consumable combination substantially the same as the control consumable combination under a set of test conditions substantially the same as the set of control conditions. The method further includes generating a test data set which describes the processing of the test wafer with the CMP apparatus. The method also includes comparing the test data set with the control data set so as to determine whether the test data set is the same or within a predetermined tolerance range of the control data set.

Method of testing the processing of a semiconductor wafer on a CMP apparatus

Growing community of inventors

San Jose, CA, United States of America

Pepito Galvez