National Semiconductor Corporation

Peng Yeen Chan

Ah Lek Hu

Sharon Mei Wan Ko

Jaime A Bayan

A method is provided for processing a lead frame. Generally, a first surface of a lead frame base tape is placed on a first surface of the lead frame. A second surface of the lead frame base tape is placed on a first surface of a porous block. A vacuum is placed on a second surface of the porous block. A device for processing lead frames comprises a porous block with a first side and a second side, and a vacuum system connected to the first side of the porous block. The device may also include devices for attaching chips to the lead frame and wire bonding the chips to the lead frame.

Universal clamping mechanism

A cooling system to reduce damage resulting from panel singulation is provided. A panel may be formed by encapsulating a lead frame with mounted dice. The encapsulating material may be a composite, plastic, or ceramic. Singulation may be a cutting done by laser, water jet, or saw. A chiller system cools a fluid, such as water, to a temperature below 16&deg; C. The cooled fluid is dispensed to a part of the panel being singulated. For example, if a circular saw is used to cut the panel, a plurality of nozzles may be used to direct the fluid to the part of the saw cutting the panel, which defines the part of the panel being singulated. The cooled fluid, cools the panel preventing burring, smearing, and melting of metal contacts.

Growing community of inventors

Melaka, Malaysia

Peng Yeen Chan