Semiconductor Manufacturing International (Shanghai) Corporation

Opple Lighting Co., Ltd.

Peng Ren

Hongbo Wang

Chaobo Liu

Xuejun Feng

Qiang Xu

The present disclosure discloses a lighting device and relates to the field of lighting technology. The lighting device includes a housing, a light source module, a power supply module, a control module, and a sensing module. The light source module, the power supply module, and the control module are collectively accommodated in an accommodating cavity of the housing. The sensing module is configured to detect environmental information, and the control module is configured to adjust brightness of the light source module in combination with remaining electric quantity of the power supply module and the environmental information, so as to adjust the brightness of the light source module according to the actual use environment and the working conditions of the lighting device itself, thereby achieving the purpose of energy saving.

Lighting device

A method for fabricating a semiconductor structure includes providing a substrate with a first surface and a second surface, wherein at least one soldering pad is formed on the first surface of the substrate. The method also includes forming at least one via to expose each soldering pad by etching the substrate from the second surface, forming a seed layer to cover the second surface of the substrate and the sidewall and the bottom surfaces of each via, and then forming a redistribution metal layer over a portion of the seed layer formed on the sidewall and the bottom surfaces of each via and the second surface of the substrate surrounding each via. The method further includes alternately performing a pre-wetting process and a chemical etching process to completely remove the portion of the seed layer not covered by the redistribution metal layer.

Growing community of inventors

Shanghai, China

Peng Ren