Intel Corporation

Sk Hynix Nand Product Solutions Corp.

Altera Corporation

Apple Inc.

Advanced Micro Devices Corporation

Peng Li

Martin Langhammer

Sergey Yuryevich Shumarayev

Sanjeev N Trika

Chia-Pin Chiu

Jawad Basit Khan

Hyunwoo Nho

Weiqi Ding

Thungoc M Tran

Zhimin Wan

Sergio Antonio Chan Arguedas

Masashi Shimanouchi

Deepak Goyal

Hsinho Wu

Amitesh Saha

Jackson Ellis

Jie Won Ryu

Cheng Xu

Jon M Long

Chandra Mohan Jha

Junnan Zhao

ByoungSuk Kim

Kyung Wook Kim

Ying Wang

Kwang Soon Park

Myungjoon Choi

Jin Yang

Jie Shen

Myron Loewen

Mingde Pan

Tien Duc Pham

Yanjing Ke

Jason N Gomez

Sriram Narayan

Aravindha Antoniswamy

Vehbi Calayir

Xiong Liu

Ken P Hackenberg

Sangeeta Raman

Yao Shi

James E Brown

Jason C Hu

Bamidele Daniel Falola

Joel Martinez

Marco Aurelio Cartas

Susmriti Das Mahapatra

Changwei Liang

Evan P Donoghue

David C Estrada

On-SSD-copy using Copy-On-Write (COW) techniques track indirection updates to the copied data without duplicating the data. In one example, a method involves receiving a copy command to copy data from a source LBA to a destination LBA. An entry in a logical-to-physical (L2P) table corresponding to the destination LBA is updated to refer to the same physical address as the source LBA's entry in the L2P table. Flags in the L2P table are updated to indicate that more than one LBA refers to the same physical address. After updating the L2P table and before copying the data, a token is stored to the storage device. After storing the token, but before copying the data, an acknowledgement can be sent to the host to indicate the copy command is complete. A subsequent write to either the source or destination LBAs trigger a copy of the data.

On-SSD-copy techniques using copy-on-write

Systems and devices are provided for receiving or transmitting IQ data (e.g., suitable for passband quadrature amplitude modulation (QAM)) over a wireline using pairs of baseband pulse amplitude modulation (PAM-n) signals. Encoding circuitry may map data from an input bit stream to IQ data that includes an in-phase component and a quadrature-phase component. Modulator circuitry may determine an in-phase PAM-n signal based on the in-phase component and a quadrature-phase PAM-n signal based on the quadrature-phase component. Driver circuitry may transmit the in-phase PAM-n signal and the quadrature-phase PAM-n signal across a wireline channel. The in-phase PAM-n signal may be different by 90° from the quadrature-phase PAM-n signal. This may enable a remote receiver on the wireline channel to detect the in-phase PAM-n signal independently of the quadrature-phase PAM-n signal.

Systems and methods for supporting both pulse amplitude modulation and quadrature amplitude modulation

Embodiments disclosed herein include thermoelectric cooling (TEC) dies for multi-chip packages. In an embodiment, a TEC die comprises a glass substrate and an array of N-type semiconductor vias and P-type semiconductor vias through the glass substrate. In an embodiment, conductive traces are over the glass substrate, and individual ones of the conductive traces connect an individual one of the N-type semiconductor vias to an individual one of the P-type semiconductor vias.

TEC-embedded dummy die to cool the bottom die edge hotspot

Disclosed herein are integrated circuit (IC) packages with solder thermal interface materials (STIMs) with embedded particles, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, a die between the package substrate and the lid and a STIM between the die and the lid. The STIM may include embedded particles, and at least some of the embedded particles may have a diameter equal to a distance between the die and the lid.

Integrated circuit packages with solder thermal interface materials with embedded particles

An embodiment of an electronic apparatus may include one or more substrates, and logic coupled to the one or more substrates, the logic to control access to a primary persistent storage with a first type of media and a nonvolatile memory buffer with a second type of media that is different from the first type of media, store metadata for incoming write data in the nonvolatile memory buffer, store other data for the incoming write data in the primary persistent storage, and provide both runtime and power-fail write atomicity for the incoming write data. Other embodiments are disclosed and claimed.

SSD managed host write atomicity with arbitrary transfer length

An electronic display may include a touch sensing system configured to perform touch sensing in an active area of the electronic display and display driver circuitry configured to program display pixels of the active area to emit light. The electronic display may also include the active area. The active area may include a first portion and a second portion that are at least partially electrically separated. The display driver circuitry may program the display pixels in the first portion while the touch sensing circuitry may perform touch sensing in the second portion.

Split display driver circuitry to mitigate touch sensing system interaction

Embodiments may relate to a microelectronic package comprising that includes a solder thermal interface material (STIM). The STIM may include indium and a dopant material which may provide a number of benefits to the STIM. The STIM may physically and thermally couple a die and an integrated heat spreader (IHS). Other embodiments may be described or claimed.

Solder thermal interface material (STIM) with dopant

Embodiments include semiconductor packages. A semiconductor package includes first and second bottom dies on a package substrate, first top dies on the first bottom die, and second top dies on the second bottom die. The semiconductor package includes thermally conductive slugs on the first bottom die and the second bottom die. The thermally conductive slugs are comprised of a high thermal conductive material. The thermally conductive slugs are positioned directly on outer edges of top surfaces of the first and second bottom dies, inner edges of the top surfaces of the first and second bottom dies, and/or a top surface of the package substrate. The high thermal conductive material of the thermally conductive slugs is comprised of copper, silver, boron nitride, or graphene. The thermally conductive slugs may have two different thicknesses. The semiconductor package may include an active die and/or an integrated heat spreader with the pedestals.

Thermally conductive slugs/active dies to improve cooling of stacked bottom dies

A multichip package may include at least a package substrate, a main die mounted on the package substrate, a transceiver die mounted on the package substrate, and an optical engine die mounted on the package substrate. The main die may communicate with the transceiver die via a first high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die may communicate with the optical engine die via a second high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die has physical-layer circuits that directly drive the optical engine. An optical cable can be connected directly to the optical engine of the multichip package.

Integrated circuit package with electro-optical interconnect circuitry

A method facilitates determining transmission loss in a transmission signal and adjusting a receiver setting of a receiver to compensate for the transmission loss. The method includes transmitting a transmission signal from a transmitter and receiving the transmission signal by a first receiver and a second receiver. The method includes digitizing the transmission signal by the first receiver at a first sampling frequency and digitizing the transmission signal by the second receiver at a second sampling frequency that is less than or equal to the first sampling frequency. The method includes generating a PAM-n eye diagram of the transmission signal by the second receiver using digitized signals digitized by the first and second receivers and adjusting an equalizer setting of a first equalizer of the first receiver using eye-opening information of the PAM-n eye diagram where the eye-opening information includes information for the transmission loss.

Techniques for generating a PAM eye diagram in a receiver

Disclosed herein are vented lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A vent may extend between the interior surface and the exterior surface of the lid, and the vent may at least partially overlap the die.

Vented lids for integrated circuit packages

A socket actuation mechanism for package insertion and package-socket alignment, including: a socket frame comprising a plurality of first hinge portions; a carrier frame comprising: a center portion comprising one or more package interlocks; and a tab extending from a first end of the carrier frame, the tab comprising a second hinge portion couplable with the plurality of first hinge portions to form a hinge coupling the carrier frame to the socket frame.

Socket actuation mechanism for package insertion and package-socket alignment

Growing community of inventors

Palo Alto, CA, United States of America

Peng Li