Industrial Technology Research Institute

Peng-Jen Chen

Chung-Yuan Su

Feng-Chia Hsu

Chao-Ta Huang

Bor-Shiun Lee

Shing-Cheng Chang

Meng-Chiao Tsai

A sensing module includes a hollow body, a first photo sensor, and a second photo sensor. The hollow body includes a cavity portion and an insertion portion connected to each other. The insertion portion has a first channel and a second channel. The first photo sensor is disposed in the cavity portion of the hollow body and corresponds to the first channel to sense an ambient temperature and a test object temperature. The second photo sensor is disposed in the cavity portion of the hollow body and corresponds to the second channel to sense the ambient temperature.

Sensing module

A MEMS apparatus with heater includes central part, periphery part, gap and first connecting part. Central part includes center of mass, heater and first joint. Heater is disposed inside central part. First joint is located on boundary of central part. Displacement of first joint is produced when central part is heated by heater. Periphery part surrounds central part. Gap surrounds central part, and is located between central part and periphery part. First connecting part connects central part and periphery part along first reference line and includes first inner connecting portion and first outer connecting portion. First inner connecting portion is connected to first joint. First outer connecting portion is connected to periphery part. First reference line passes through first joint, and first reference line is not parallel to line connecting center of mass and first joint.

Microelectromechanical system apparatus with heater

An infrared sensor including a substrate, an infrared absorption layer and a concave is provided. The infrared absorption layer is formed on a substrate and has a sensing surface. The concave extends toward the substrate from a sensing surface of the infrared absorption layer.

Growing community of inventors

Kaohsiung, Taiwan

Peng-Jen Chen