Hisense Broadband Multimedia Technologies Co., Ltd.

Hisense Broadband Multimedia Technologies, Ltd.

Hisense International Co., Ltd.

Peng He

Sigeng Yang

Haiqiang Xu

Tao Wu

Xuxia Liu

Jianwei Mu

Yongliang Huang

Yinlong Liu

Shijian Ben

Jingsheng Xia

Shengwei Bo

Tengyue Li

Qian Shao

Wei Cui

Hongchao Pan

Baofeng Si

Shuai Zhang

Fenglai Wang

Chengshuang Luo

An optical module includes a shell, a circuit board, at least one of a light-transmitting chip or a light-receiving chip, a lens assembly and a claw assembly. The lens assembly includes a lens base and a connecting part. The lens base covers the at least one of the light-transmitting chip or the light-receiving chip, and is configured to change a propagation direction of an optical signal incident into the lens assembly. The connecting part includes at least one positioning slot disposed on a surface of the connecting part facing away from the lens base. The claw assembly includes a claw and a through hole. The claw includes at least one positioning protrusion disposed on a surface of the claw facing the connecting part. The through hole is configured to be connected to an optical fiber outside the optical module.

Optical module

An optical module includes a circuit board, a light transmit-receive device and a data processor. The light transmit-receive device includes a first laser array, a first detector array and a first lens assembly. The first laser array is disposed on the circuit board, and is configured to emit a plurality of channels of optical signals driven by the plurality of channels of low-speed electrical signals. The first detector array is disposed on the circuit board, and is configured to receive the plurality of channels of optical signals from outside of the optical module, and convert the plurality of channels of optical signals into a plurality of channels of electrical signals. The first lens assembly covers the first laser array and the first detector array, and is configured to change a propagation direction of optical signals incident into inside of the first lens assembly.

An optical module includes a circuit board, a light emitting device and a data processor. The data processor is disposed on the circuit board. The data processor includes a reverse gearbox and a gearbox. The reverse gearbox is connected to the light emitting device, and is configured to receive a high-speed electrical signal from the circuit board, and decode the high-speed electrical signal into a plurality of channels of low-speed electrical signals. The plurality of channels of low-speed electrical signals drive the light emitting device to emit the plurality of channels of optical signals. The gearbox is connected to the light receiving device, and is configured to receive a plurality of channels of low-speed electrical signals output by the light receiving device, encode the plurality of channels of low-speed electrical signals into a high-speed electrical signal, and transmit the high-speed electrical signal to the circuit board.

An optical module includes a circuit board, an optical emission chip array, an optical receiver chip array, an optical fiber array, and a lens assembly. The lens assembly includes a body with a step provided at a bottom portion thereof, an emission lenses array, an optical fiber lenses array, and a receiving lenses array. The emission lenses array and the receiving lenses array are respectively arranged on two step surfaces of the step, such that focal points thereof respectively fall on an emission surface of the optical emission chip array and a light sensitive surface of the optical receiver chip array. A first groove for forming a first reflective surface and a second groove for arranging a light filter that refracts light towards the optical fiber lenses array or reflects light to the receiving lenses array are provided at a top portion of the body.

An optical module is provided in the present disclosure. According to an embodiment, the optical module may comprise a housing, two or more circuit board layers, and a light emitting chip. The two or more circuit board layers may be disposed in the housing and electrically connected to each other; and the light emitting chip may be electrically connected to at least one of the circuit board layers.

The disclosure provides an optical module, including a housing, a circuit board and a light conducting structure; a portion of the light conducting structure is disposed in the housing, another portion of the light conducting structure juts out from the housing; the circuit board is provided with a light source, and the light conducting structure is configured to conduct light emitted by the light source to an outside of the housing. The optical conducting module in the optical module can conduct light emitted from the optical module to outside of the optical module. The optical module allows the state inside the optical module to be conducted to and displayed in the outside of the optical module with optical signals as propagation medium. The state inside the optical module can be directly learned from the outside of the optical module housing, thereby extending application scenarios of the optical module.

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Qingdao, China

Peng He