Sandisk Information Technology (shanghai) Co., Ltd.

Sandisk Semiconductor (shanghai) Co. Ltd.

Peng Fu

Cheeman Yu

Zhong Lu

Hem P Takiar

Chin-Tien Chiu

Li Ping Wang

Ning Ye

Suresh Kumar Upadhyayula

Chin Tien Chiu

Weili Wang

Ye Bai

Kim Lee Bock

Weiting Jiang

Kaiyou Qian

King Hoo Ong

Yuang Zhang

Enyong Tai

Shan Luo

Pradeep Kumar Rai

Matthew Chen

A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Semiconductor device including independent film layer for embedding and/or spacing semiconductor die

A memory device including a metallic layer shielding electromagnetic radiation and/or dissipating heat, and a method of making the memory device, are disclosed. The metallic layer is formed on a metallic layer transfer assembly. The metallic layer transfer assembly and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the metallic layer is transferred from the shield to the encapsulated memory device.

EMI shielding and thermal dissipation for semiconductor device

Growing community of inventors

Kunshan, China

Peng Fu