Dow Corning Corporation

Dow Silicones Corporation

Northwestern University

University of Michigan

Peng-Fei Fu

Eric S Moyer

Craig Rollin Yeakle

Jason Suhr

Tobin Jay Marks

Yanhu Wei

Wonbum Jang

Lingjie Jay Guo

Wei Rong

Francois De Buyl

Zhenbin Niu

Sheng Wang

Byung Keun Hwang

Gary Thomas Burns

Valerie Smits

Xing Cheng

Lizhi Liu

Tobin J Marks

Eric Scott Moyer

Craig Yeakle

Gary Burns

A composition containing: (a) a polysiloxane resin, wherein the polysiloxane resin contains the following siloxane units: [R3SiO], [(OZ)SiO] and at least one of [(OZ)RSiO] and [(OZ)RRSiO]; where: each R is independently in each occurrence selected from hydrocarbyls, Ris an epoxy functional hydrocarbyl group, subscript q is in each occurrence a number selected from a range of 0-3, subscript t is in each occurrence a number selected from a range of 0-2, and subscript d is in each occurrence a number selected from a range of 0-1 provided that the average concentration of OZ groups is at least 15 mole-percent relative to moles of silicon atoms in the polysiloxane resin; (b) a photo acid generator; (c) a moisture cure catalyst; and (d) optionally, an epoxy functional diluent.

Dual cure composition

An epoxy-curable silicone release coating composition and methods for its preparation and use are provided. The composition contains an inhibited Lewis acid catalyst. Releasing the Lewis acid catalyst from the inhibitor allows the Lewis acid to catalyze cure of the epoxy-groups. The composition can be coated on various substrates and cured to form a release liner.

Epoxy-curable silicone release coating composition and methods for its preparation and use

A silsesquioxane resin, photoresist composition comprising the silsesquioxane resin and a photoacid generator, etching mask composition comprising the silsesquioxane resin, products prepared therefrom, methods of making and using same, and manufactured articles and semiconductor devices containing same. The silsesquioxane resin comprises silicon-bonded hydrogen atom T-units and T-units having a silicon-bonded group of formula &#x2014;CHCHCHCOC(R)or &#x2014;CH(CH)CHCOC(R), wherein each Ris independently an unsubstituted (C-C)alkyl.

Silicon-rich silsesquioxane resins

A method for producing a patterned silicone layer; said method comprising steps of: (a) depositing on a substrate a composition comprising: (i) a polysiloxane comprising alkenyl groups, (ii) a silane crosslinker comprising silicon-hydrogen bonds, (iii) a hydrosilylation catalyst, and (iv) a photolatent amine generator, to form an uncured resin; (b) exposing the uncured resin to ultraviolet light or electron beam irradiation through a mask to produce a patterned resin; (c) heating the patterned resin; and (e) removing at least a part of the uncured portion of the patterned resin to produce a final patterned silicone layer.

Positive tone photopatternable silicone

A silsesquioxane-containing composition comprising a silsesquioxane resin and an oxaamine of formula (II) (see description), products prepared therefrom, photoresist compositions comprising the silsesquioxane-containing composition and a photoacid generator, products prepared therefrom, methods of making and using same, and manufactured articles and semiconductor devices containing same.

Silsesquioxane resin and oxaamine composition

A bridged silicone resin is disclosed which has the general formula (1): (HSiO)(RSiO)(RSiO)(SiO&#x2014;X&#x2014;SiO); wherein x and s are each from &#x3e;0 to &#x3c;1 and 0&#x3c;y+z&#x3c;1 such that x+y+z+s=1; R is independently an alkyl group; Ris independently an aryl group; and X is divalent group comprising a silarylene group or a &#x2014;(CH)SiRR[O(SiRRO)]SiRR&#x2014;(CH)&#x2014; group, where n is an integer from 1 to 10, each Rand Ris an independently selected substituted or unsubstituted hydrocarbyl group, and q and q' are each independently integers selected from 0 or from 1 to 6. Various methods relating to the bridged silicone resin and end uses thereof are also disclosed.

Bridged silicone resin, film, electronic device and related methods

A bridged silicone resin is disclosed which has the general formula (1): (HSiO)(SiO&#x2014;X&#x2014;SiO)(1); wherein x and y are each from &#x3e;0 to &#x3c;1 such that x+y=1; and wherein X is divalent group comprising a silarylene group or a &#x2014;(CH)SiRR[O(SiRRO)]SiRR&#x2014;(CH)&#x2014; group, where n is an integer from 1 to 10, each R and Ris an independently selected substituted or unsubstituted hydrocarbyl group, and q and q' are each independently integers selected from 0 or from 1 to 6. Various methods relating to the bridged silicone resin and end uses thereof are also disclosed.

An aged polymeric silsesquioxane comprising a product of heating a cured polymeric silsesquioxane of formula (I) (see specification) at a temperature of from 460&#xb0; to 700&#xb0; C., a formulation comprising the aged polymeric silsesquioxane and at least one additional constituent, methods of making and using the aged polymeric silsesquioxane, and manufactured articles and devices containing the aged polymeric silsesquioxane.

Aged polymeric silsesquioxanes

Fluoro-containing silicone-based storage stable temporary bonding adhesive compositions are disclosed. The adhesive compositions can be used in varied applications including, but not limited to, 3D chip integration, packaging applications, semiconductor devices, radio-frequency identification tags, chip cards, high-density memory devices, and microelectronic devices. The adhesive compositions generally comprise: a) a fluoro-containing silicone having the general formula (I); M'[DDD]M&#x2032; wherein M&#x2032; is a vinyl or hydrogen functionalized unit; Dunit comprises a fluoro-substituted group; Dunit comprises a vinyl or SiH functionalized group; 1&#x3e;o&#x2265;0, 1&#x3e;p&#x3e;0, and 1&#x3e;q&#x2265;0 wherein o+p+q=1 and p is equal to or less than 20% mole percent of the sum of o+p+q; and n is an integer from 1 to 1000; b) an alkenyl functional polydimethylsiloxane fluid; c) an alkenyl functional MQ siloxane resin; d) an SiH functional siloxane crosslinker; and e) a hydrosilylation catalyst.

Fluoro-silicone compositions as temporary bonding adhesives

Provided in various embodiments are methods for making ultraviolet radiation curable (UV-curable) silicone compositions and the UV-curable silicone compositions prepared by such methods. Provided in various embodiments are methods for making anti-dust coatings using such UV-curable silicone compositions and the anti-dust coatings using such UV-curable silicone compositions prepared by such methods. The UV-curable silicone compositions may be used in the coating of silicone-based articles for LED packages, encapsulants, lamps, luminaires, optical articles and the like, substantially reducing and/or eliminating the pick-up of dust and improving optical properties of the silicone-based articles.

UV-curable silicone compositions and anti-dust coating compositions containing same

Methods for producing a silyl-functionalized polyolefin with silyl monomer incorporation are provided. The method includes reacting a silicon-containing olefin with an &#x3b1;-olefin, in the presence of a catalytic amount of a group IV catalyst for a time sufficient to produce a silyl-functionalized polyolefin.

Method for producing silyl-functionalized polyolefins and silyl-functionalized polyolefins with silyl monomer incorporation

A coatable resin solution capable of forming a coating when applied to the surface of a substrate that is photo-patternable and developable as a dielectric material upon exposure to ultraviolet radiation is provided. The resin solution comprises a silsequioxane-based (SSQ-based) resin, at least one initiator, and an organic solvent. The SSQ-based resin includes both a hydride component and at least one photo-curable component. The resulting coating exhibits a dielectric constant that is less than or equal to about 3.5.

Photo-patternable and developable silsesquioxane resins for use in device fabrication

A silsesquioxane resins useful in antireflective coatings wherein the silsesquioxane resin has the formula(PhSiO(OR'))(HSiO(OR&#x2032;))(MeSiO(OR&#x2032;))(RSiO(OR&#x2032;))and a method of forming an antireflective coating on an electronic device comprising applying to an electronic device an antireflective coating composition comprising the silsesquioxane resin and a solvent, and removing the solvent and curing the silsesquioxane resin to form an antireflective coating on the electronic device.

Silsesquioxane resins and method of using them to form an antireflective coating

This invention pertains to silsesquioxane resins useful in antireflective coatings wherein the silsesquioxane resin comprises the units (Ph(CH)SiO(OR'))(HSiO(OR&#x2032;))(MeSiO(OR&#x2032;))(RSiO(OR&#x2032;))(RSiO(OR&#x2032;))where Ph is a phenyl group, Me is a methyl group; R&#x2032; is hydrogen atom or a hydrocarbon group having from 1 to 4 carbon atoms; R is selected from a carboxylic acid group, a carboxylic acid forming group, and mixtures thereof; and Ris selected from substituted phenyl groups, ester groups, polyether groups; mercapto groups, sulfur-containing organic functional groups, hydroxyl producing group, aryl sulphonic ester groups, and reactive or curable organic functional groups; and r has a value of 0, 1, 2, 3, or 4; x has a value of 0, 1 or 2; wherein in the resin m has a value of 0 to 0.90; n has a value of 0.05 to 0.99; o has a value of 0 to 0.95; p has a value of 0.01 to 0.5; q has a value of 0 to 0.5; and m+n+o+p+q&#x2248;1.

Silsesquioxane resins

A silsesquioxane resin is applied over the patterned photo-resist and cured at the pattern surface to produce a cured silsesquioxane resin on the pattern surface. The uncured silsesquioxane resin layer is then removed leaving the cured silsesquioxane resin on the pattern surface. The cured silsesquioxane resin on horizontal surfaces is removed to expose the underlying photo-resist. This photo-resist is removed leaving a pattern of cured silsesquioxane. Optionally, the new pattern can be transferred into the underlying layer(s).

Growing community of inventors

Midland, MI, United States of America

Peng-Fei Fu