Inphi Corporation

Luxnet Corporation

Marvell Asia Pte., Ltd.

Nanjing Casela Technologies Corporation Limited

Nanjing Casela Technologes Corporation Limited

Peng-Chih Li

Radhakrishnan L Nagarajan

Masaki Kato

Pi-Cheng Law

Imtiaz Majid

Chih-Hao Wang

Chris Togami

A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

Small form factor transmitting device

A photon source may be composed of a substrate defining a planar surface, an optical shell having an annular base surface disposed above the substrate, and a plurality of optical sources. Each optical source may be composed of a mirror and an optical emitter aligned with the mirror along an optical axis. The mirror may be configured to reflect a collimated optical beam emitted by the optical emitter onto the annular base surface. The mirrors of the plurality of optical sources may be arranged in a first ring-like configuration. The annular base surface may be disposed above the first ring-like configuration. The optical emitters of the plurality of optical sources may be arranged in a second ring-like configuration. In one aspect, the optical shell may be a hollow frustum. In another aspect, a focus lens may be disposed between the substrate and the optical shell.

Photon source comprising a plurality of optical sources and an optical shell to receive the light emitted by the optical source

A photon source may have a substrate, a focus lens disposed above the substrate, and a plurality of optical sources disposed on the substrate. Each optical source may have a mirror disposed on the substrate configured to reflect a collimated beam emitted by an optical emitter disposed on the substrate. The plurality of mirrors may be arranged in a first ring-like configuration defining a first diameter. The plurality of optical emitters may be arranged in a second ring-like configuration defining a second diameter which is larger than the first diameter. In some aspects each optical source may include a second optical emitter emitting a second optical beam and an optical combiner configured to combine the first emitted optical beam and the second emitted optical beam to form the collimated beam. In another aspect, the photon source may be composed of a vertical array of multiple substrates.

Fiber photon engine comprising cylindrically arranged planar ring of diodes coupled into a capillary/shell fiber

A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

Package structure for photonic transceiving device

An aspect of a photon source may have a substrate with a surface, a focus lens disposed above the surface, and a plurality of optical sources. Each optical source may be composed of a mirror and an optical emitter. The optical emitter may include a beam twister. The emitter is aligned with the mirror along an axis and may emit a collimated beam along the axis, A plurality of mirrors may be composed of each mirror of the plurality of optical sources, arranged in a first ring-like configuration. Alternatively, the plurality of mirrors may be aggregated into a polygonal pyramidal mirror. A plurality of emitters may be composed of each emitter of the plurality of optical sources, arranged in a second ring-like configuration. The optical emitters may be composed of a laser diode mounted on a sub-mount having a plane orthogonal to the planar surface.

Fiber optic photon engine

A photonic transceiver apparatus in Quad Small Form-factor Pluggable (QSFP) package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a printed circuit board (PCB), installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

Growing community of inventors

Santa Clara, CA, United States of America

Peng-Chih Li