Fih (hong Kong) Limited

Shenzhen Futaihong Precision Industry Co., Ltd.

Peng-Cheng Tong

Po-Feng Ho

Kai-Rong Liao

Shih-Wei Yang

A housing includes housing and a cover. The housing defines a receiving chamber and an open end communicating with the receiving chamber. The housing includes an opaque plastic member and a transparent glass member adhered to the plastic member. The opaque plastic member defines a display window hole. The cover seals the open end. The present disclosure further discloses an electronic device using the housing.

Housing and electronic device using the same

An electronic device includes a housing and an electronic module. The housing includes a transparent main body, a masking layer partially adhered to the transparent main body, and a cover. A bare area is exposed forming the masking layer to define a transparent window. The housing defines a receiving chamber and an open end communicating with the receiving chamber. The electronic module includes a touch display screen. The electronic module is received in the receiving chamber, the touch display screen aligns to the transparent window, and the cover seals the open end. The present disclosure further discloses a housing for the electronic device and a method for making the housing.

Housing for electronic devices and method for making the same

An exemplary electrophoretic coating method and an electroplated shell () manufactured thereby is provided. The electrophoretic coating method includes the following steps. A first step (Step S) is to mold a base shell (). The base shell includes a base body (), a shell body (), and a connecting body (). The shell body and the connecting body are molded with the base body. The connecting body connects with the shell body. A second step (Step S) is to pretreat the shell body and the connecting body. Thus, conducting films are formed on the shell body and connecting body. A third step (Step S) is to electrophoretically coat the preliminarily treated base shell, so as to form electroplated layers on the shell body. A fourth step (Step S) is to remove the connecting body so as to form/yield the electroplated shell.

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Shenzhen, China

Peng-Cheng Tong