Qualcomm Mems Technologies, Inc.

Acquis Technology, Inc.

Peng Cheng Lin

Kurt Edward Petersen

Ravindra Vaman Shenoy

William W Y Chu

Nicholas Ian Buchan

Srinivasan Kodaganallur Ganapathi

Ericson Cheng

Tony Man

This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper flexible substrate has patterned conductive material on an extended portion to allow routing of signal lines, electrical ground, and power. One or more integrated circuits or passive components, which may include connecting sockets, may be mounted onto the flexible layer to reduce cost and complexity. Such implementations may eliminate a flex cable and may allow a bezel-less configuration.

Wraparound assembly for combination touch, handwriting and fingerprint sensor

Stiffeners in are provided in a flexible printed circuit to prevent damages to leads and traces of the flexible circuit caused by bending, folding and other stresses.

System and method of preventing damage to metal traces of flexible printed circuits

A method for installing memory into a computer module. The method includes providing a used computer module, which comprises a housing to enclose a hard disk drive, a memory module for random access memory devices and a central processing unit coupled to the hard disk drive and coupled to the random access memory. The method also includes removing a top cover from a base of the housing to expose the hard disk drive and the memory module. Thereafter, the hard disk drive is removed from the base of the housing and a second hard disk drive is inserted onto the base. The top cover is reattached to the base of the housing to complete the installation process.

Computer module device and method

Growing community of inventors

Cupertino, CA, United States of America

Peng Cheng Lin