Apple Inc.

Facebook, Inc.

Sandisk Information Technology (shanghai) Co., Ltd.

Peng Chen

Colleen F Mischke

Hem P Takiar

Lidu Huang

Wei Wei

Ning Ye

Qiang Yang

Suresh Kumar Upadhyayula

Yazan Z Alnahhas

Nagarajan Kalyanasundaram

Himesh Patel

Chin Tien Chiu

Tanmoy Chakraborty

Anuranjini Pragada

Christopher Hu

Harsh Doshi

Zeyue Chen

Sagar Chordia

Alaa Al-okaily

Derek J Iredale

Ahmed Rashid

Michael R Monson

Pierre P Souloumiac

Talisa Mohammad Nejad

Xiao Hu

A flexure for a camera module is provided. The flexure includes a dynamic platform to which an image sensor is connected such that the image sensor moves with the dynamic platform. The flexure also includes a static platform connected to a static portion of the camera. The flexure further includes a plurality of flexure arms that mechanically connect the dynamic platform to the static platform. The plurality of flexure arms includes a first flexure arm including one or more signal traces having a first impedance and a base layer having a first width. The plurality of flexure arms includes a second flexure arm including one or more signal traces having a second impedance and a base layer having a second width. The first impedance is greater than the second impedance. The first width is less than the second width. The second flexure arm routes image data from the image sensor.

Variable flexure arm sizes for flexure module of camera with moveable image sensor

An optical module includes an enclosure and an optical output assembly mounted on the enclosure. An emitter mounted in the enclosure is configured to emit a beam of light toward the optical output assembly. A connector, which includes two conductive layers separated by a dielectric layer, has a first side connected to the enclosure and a second side connected to the optical output assembly. An electrical trace disposed on the enclosure is connected to the first side of the connector so as to define a test circuit having a capacitance. Control circuitry is coupled to sense the capacitance of the test circuit, and configured to inhibit operation of the emitter upon sensing a change in the capacitance that exceeds a predetermined threshold.

Mini-interconnect capacitor

An electronic module includes an operational subunit, having upper, lower and lateral surfaces, and including one or more electronic components, which are adjacent to the lower surface of the operational subunit and generate heat when the module is in operation. A heat sink is disposed in proximity to the lower surface of the operational subunit. A heat spreader, including a continuous sheet of a heat-conducting material, is folded to wrap around the operational subunit so that a lower side of the sheet is interposed between the lower surface of the operational subunit and the heat sink and a lateral side of the sheet extends around at least one of the lateral surfaces of the operational subunit.

Efficient heat removal from electronic modules

An online system provides a feed of content including organic content items and sponsored content items that are positioned relative to each other to maximize user interaction with the feed of content. To reduce latency of providing the feed of content to a user without impairing positioning of organic content items and sponsored content items relative to each other, the online system initially selects a subset of sponsored content items based on characteristics (e.g., bid amounts) of the sponsored content items. Subsequently, the online system applies one or more selection processes to organic content items and to sponsored content items of the subset that accounts for positioning of sponsored content items and organic content items relative to each other within the feed of content. Hence, the online system evaluates the subset of sponsored content items along with organic content items when ordering content within the feed.

Selecting sponsored content and organic content for presentation to an online system user while accounting for relative positioning of sponsored content and organic content

A semiconductor device vertically mounted on a medium such as a printed circuit board, and a method of its manufacture, are disclosed. The semiconductor device includes a stack of semiconductor die having contact pads which extend to an active edge of the die aligned on one side of the stack. The active edges of the die are affixed to the PCB and the contact pads at the active edge are electrically coupled to the PCB. This configuration provides an optimal, high density arrangement of semiconductor die in the device, where a large number of semiconductor die can be mounted and electrically coupled directly to the PCT, without a substrate, without staggering the semiconductor die, and without using wire bonds.

Vertical semiconductor device having a stacked die block

Growing community of inventors

Fremont, CA, United States of America

Peng Chen