Taiwan Green Point Enterprises Co., Ltd.

Pen-Yi Liao

Sheng-Hung Yi

Hui-Ching Chuang

Wen-Chia Tsai

Chih-Hao Chen

Jing-Yi Yang

Ai-Ling Lin

Yu-Chuan Lin

Chung-Ho Liu

Hung-Chun Chen

Po-Cheng Huang

Tsung-Han Wu

Yao-Tsung Ho

Yu-Cheng Chen

Hung-San Pan

Shen-Hung Yi

Chia-Tai Chen

Min-Hsiang Chen

A conformal array antenna includes a substrate and a conductive circuit. The substrate has a non-conductive roughened curved surface formed with a plurality of hook-shaped structures that are formed by blasting a plurality of particles on the substrate. The non-conductive roughened curved surface defines a plurality of spaced-apart antenna pattern regions. The conductive circuit is located in the antenna pattern regions, and includes an activation layer formed on the roughened curved surface and containing an active metal, and a first metal layer formed on the activation layer.

Conformal array antenna

A catalyst for a catalytic ink includes a support particle and a metallic material supported on the support particle. The metallic material is diamminesilver hydroxide, a silver salt, a palladium salt, a gold salt, chloroauric acid, or combinations thereof. A catalytic ink obtained from the catalyst and use of the same to fabricate a conductive circuit are also disclosed.

Catalytic ink comprising metallic material made from diamminesilver hydroxide, and uses thereof

A method for making a conformal array antenna includes: providing a substrate having a non-conductive curved surface; roughening the curved surface; forming an activation layer containing an active metal on the roughened curved surface; forming a first metal layer on the activation layer by chemical plating process; and defining a plurality of spaced-apart antenna pattern regions on the first metal layer, by forming a gap along an outer periphery of each of the antenna pattern regions to isolate the antenna pattern regions from a remainder of the first metal layer. The curved surface is roughened by blasting a plurality of particles thereonto, or the spaced-apart antenna pattern regions are substantially evenly distributed.

Method of making a conformal array antenna

An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.

Illumination assembly, method of manufacturing the illumination assembly, and backlight module including the illumination assembly

A light emitting device includes a heat sinking substrate, an electrically insulating layer partially formed on the heat sinking substrate, a circuit pattern layer formed on the electrically insulating layer, a light emitting diode (LED) chip, and an electrically insulating and thermally conductive interlayer. The LED chip is indirectly and non-electrically mounted to the heat sinking substrate. The electrically insulating and thermally conductive interlayer is interposed between the bottom portion of the LED chip and a portion of the heat sinking substrate exposed from the electrically insulating layer. A bottom portion of the LED chip bridges the electrically insulating and thermally conductive interlayer and the circuit pattern layer.

Light emitting device

A method of forming a patterned metal unit on an article. The method includes the steps of: providing an article that has an insulating surface; transferring a catalyst layer onto the insulating surface of the article, the catalyst layer including a catalytic material; removing a part of the catalyst layer to form a patterned catalyst layer; and forming a patterned metal layer on the patterned catalyst layer by an electroless plating technique to obtain a patterned metal unit that is constituted by the patterned catalyst layer and the patterned metal layer.

Method of forming patterned metal unit, and patterned article formed with the same

An illuminating device includes an insulative housing, at least two electrodes and a light source. The insulative housing has opposite front and rear surfaces and is formed with at least two through holes. Each of the through holes is defined by a hole wall and penetrates the front and rear surfaces. Each of the electrodes includes a first conductive segment formed proximate the front surface, a second conductive segment formed proximate the rear surface, and a connecting segment formed inside a respective one of the through holes and interconnecting electrically the first and second conductive segments. The light source is disposed on the front surface and includes first and second connecting terminals each being electrically coupled to the first conductive segment of a corresponding one of the electrodes.

Illuminating device and methods for making the same

Catalyst for a catalytic ink and uses thereof

Illumination assembly, method of manufacturing the Illumination assembly, and backlight module including the illumination assembly

A method for making a capacitive touch sensitive housing, comprises: forming a non-patterned active metal layer on a housing wall; patterning the non-patterned active metal layer on the housing wall by laser ablation such that the non-patterned active metal layer is formed into a patterned active metal layer including a plurality of plating portions separated from each other, and a plurality of non-plating portions separated from the plating portions; and forming a metal layer on the patterned active metal layer such that the metal layer has first portions formed on the plating portions of the patterned active metal layer, and second portions formed on the non-plating portions of the patterned active metal layer.

Capacitive touch sensitive housing and method for making the same

A method for fabricating a conductive trace structure includes the steps: forming a first metal layer on a non-conductive substrate; removing a part of the first metal layer to expose the non-conductive substrate so as to form the first metal layer into a plating region and a non-plating region, the plating region being divided into at least two trace-forming portions and at least one bridge portion; forming a second metal layer on the plating region by electroplating the plating region using one of the trace-forming portions and the bridge portion as an electrode; and removing the bridge portion and the second metal layer formed on the bridge portion.

Growing community of inventors

Taichung, Taiwan

Pen-Yi Liao