Asm Assembly Automation Limited

Asm Technology Singapore Pte Ltd

Asmpt Singapore Pte. Ltd.

Pei Wei Tsai

Chak Tong Sze

Chak Tong Albert Sze

Cho Hin Cheuk

Sai Kit Wong

Wing Sze Chan

Wai Hong Sizto

Yiu Ming Cheung

Yu Sze Cheung

Wai Chuen Gan

Lap Kei Eric Chow

Ching Man Stanley Tsui

Shing Wai Tam

Yui Kin Tang

Fong Shing Yip

Kut Lam

Hiu Fai Ho

Tsz Chun Chow

Wai Hing Yung

Ho Yin Wong

Si Ming Chan

Wa Sing Tsang

Tin Yi Chan

Kam Sing Lee

Chunbai Wang

A pick arm for a pick and place apparatus for electronic devices has a main body having a proximal end whereat the pick arm is mountable onto a pick arm support, and a distal end at which a collet is mounted for holding an electronic device. A first rigid body is located adjacent to the proximal end of the pick arm and a second rigid body is located adjacent to the distal end of the pick arm. The first and second flexures connect the first rigid body to the second rigid body. Moreover, the first flexure is spaced from the second flexure, and the first and second flexures have opposing faces that are arranged substantially parallel to each other. An actuator is operative to apply a biasing force onto the second rigid body so as to bend the first and second flexures relative to the first rigid body for biasing the collet of the pick arm to move.

Flexural pick arm for a pick and place apparatus

A semiconductor package testing apparatus comprises a package holder for holding a semiconductor package and which is positionable together with the semiconductor package at a test contactor station. There are probe pins located at the test contactor station for contacting a bottom surface of the semiconductor package and which are configured to apply an upwards force on the semiconductor package during testing of the semiconductor package. A restraining mechanism that is movable from a first position remote from the package holder and a second position over the package holder is configured to restrict lifting of the semiconductor package by the probe pins during testing of the semiconductor package when the restraining mechanism is at its second position.

Semiconductor package testing apparatus

An apparatus for maintaining a conductivity of electrical contacts of a test contactor for testing electronic devices comprises a rotary turret disk having a plurality of test stands operative to hold respective electronic devices, the electronic devices being rotatable by the rotary turret disk to a position of the test contactor to be contacted by the electrical contacts during testing. At least one contactor maintenance stand comprising a maintenance component is located between adjacent test stands on the rotary turret disk, wherein the electrical contacts of the test contactor are adapted to engage the maintenance component so as to automatically clean the electrical contacts and/or verify the conductivity thereof.

Apparatus for conducting automated maintenance of a test contactor module

A transfer apparatus has a conveying track for electronic devices in a row, two vacuum passages to create vacuum forces to hold electronic devices against the conveying track at first and second positions respectively preventing overlapping of electronic devices; and sensors arranged with respect to the conveying track, the first sensor detects presence or absence of the leading electronic device at the first position for removal of the leading electronic device from the conveying track, and the second sensor detects presence or absence of the leading electronic device at a sensor position between the first and second positions as the leading electronic device is conveyed along the conveying track from the second to the first vacuum passage.

Transfer apparatus for transferring electronic devices

A test handler comprises a package support for holding an electronic device in a certain orientation and for transporting the electronic device to a testing station for testing the electronic device. An orientation correction device is actuable and operative to engage the package support and to rotate the package support so as to change the orientation of the electronic device.

Test handler for electronic devices

A device sorting apparatusis disclosed herein. In a described embodiment, the device sorting apparatuscomprises a plurality of bin connectorsfor coupling to respective bins for storing sorted devices and a rotary distribution modulefor receiving a deviceto be sorted and for discharging the deviceselectively into one of the bin connectorsto enable the deviceto be unloaded to the respective bin. The device sorting apparatusfurther comprises a sensorcoupled to the rotary distribution modulefor detecting the discharge of the device, and which is rotatable together with the rotary distribution module; and a rotary transformerfor powering the sensor

Device sorting apparatus

A sorting system is provided for electronic components such as LED devices which includes a testing station for testing and determining a characteristic of each electronic component. A first tray has a plurality of receptacles for receiving tested electronic components and a second tray has more receptacles than the first tray for receiving tested electronic components. Electronic components comprising tested characteristics that occur with greater frequency are loaded into the receptacles of the first tray and electronic components comprising tested characteristics that occur with lower frequency are loaded into the receptacles of the second tray.

System for testing and sorting electronic components

A device handler for testing and sorting electronic devices has a testing station operative to test the electronic devices and to classify them according to different binning characteristics. A buffer assembly receives electronic devices which have been classified at the testing station, and the buffer assembly further comprises a first loading region having a plurality of receptacles and a second loading region having a plurality of receptacles. An output station is operative to unload electronic devices according to their different binning characteristics from either one of the first or second loading region of the buffer assembly for storage while electronic devices are being loaded onto the other loading region.

Electronic device sorter comprising dual buffers

A test handler is provided for testing electronic devices having light-emitting elements. Electronic devices are mounted at a loading position, optical measurements are conducted at a test contact position where a testing device is located for optical communication with the light-emitting elements and then tested electronic devices are removed at an unloading position. Multiple test contactors hold the electronic devices and move them to and through the loading position, test contact position and unloading position in sequence. Each test contactor comprises a device contact point including electrical conductors which are connected to electrical contacts of the electronic device when the electronic device is mounted at the device contact point, and a retaining mechanism grips the electronic device at the device contact point such that the retaining mechanism does not obstruct the optical communication between the testing device and the light-emitting element at the test contact position.

Test handler including gripper-type test contactor

An apparatus and method is provided for flipping electronic components in the sense of changing their orientation, such as for changing the orientation of electronic components between 'live bug' and 'dead bug' orientations. The apparatus comprises a rotary device that is configured to receive the electronic component and a force actuator operative to bias the electronic component into engagement with the rotary device. A driving mechanism coupled to the rotary device is operative to rotate said rotary device for changing the orientation of the electronic component, after which an ejector is used to eject the electronic component from the rotary device after changing the orientation of the electronic component.

Apparatus and method for flipping electronic components

The invention provides a mechanism for a test handler using for electrical testing of electronic devices. The devices are placed on a platform configured to move semiconductor devices from an onloading position to an offloading position along a predetermined path. A transfer arm with a plurality of transfer heads connected to it is located adjacent the path. The transfer heads are configured to pick up and transfer semiconductor devices from the platform to a testing position for testing, and thereafter to transfer the semiconductor devices from the testing position to the platform for offloading.

Device transfer mechanism for a test handler

This invention relates to a method and apparatus for pick and place handling of electronic components that have been formed on a common substrate and then separated on a cutting chuck. A transferring means is provided formed with openings for receiving separated components. The opening is defined by walls of which at least one is movable so as to engage the components and hold them in a fixed configuration and orientation while they are moved by a sliding motion through a processing unit and onto a transfer platform for delivery to an output track.

Growing community of inventors

Hong Kong, China

Pei Wei Tsai