Rockwell International Corporation

Pei-Ming D Chow

Keh-Fei C Chi

A method of visually monitoring the change in dimensions of elements on a surface of a semiconductor body during processing is provided. A fixed pattern of scale images on the surface with a predetermined distance between images, together with a wedge-shaped element is provided on the surface. The wedge element has an apex adjacent one of the images and extends in a direction along other ones of the images. The semiconductor body is processed and the dimensions of the wedge-shaped element (as well as the scale image) change. One may then subsequently visually inspect the wedge shaped element with respect to the pattern of images to determine the extent of the change in dimension of the wedge shaped element during processing.

Dimension monitoring technique for semiconductor fabrication

A method of quantitatively measuring the relative alignment of elements on a surface of a semiconductor body formed by two sequential masking steps during processing is provided. A fixed pattern of rectangular images are formed on a first mask; and a fixed pattern of repeating U-shaped images are formed on a second mask. The semiconductor body is processed so that the rectangular images on the first mask align with the U-shaped images on the second mask. An electrical probe is applied to opposed ends of the boustrophederal pattern formed and the electrical resistance measured to determine a parameter related to the relative alignment of elements on the semiconductor body.

Growing community of inventors

Redondo Beach, CA, United States of America

Pei-Ming D Chow