Corning Incorporated

Industrial Technology Research Institute

Pei-Lien Tseng

Prantik Mazumder

Jen-Chieh Lin

Sean Matthew Garner

Timothy James Orsley

Robert George Manley

Jiangwei Feng

Richard Curwood Peterson

Rajesh Vaddi

Michael Lesley Sorensen

Timothy Michael Gross

Adam James Ellison

Theresa Chang

Lu Zhang

Indrani Bhattacharyya

Kaveh Adib

Polly Wanda Chu

Scott Christopher Pollard

Cheng-Chung Li

Sushmit Sunil Kumar Goyal

Robert Bumju Lee

Dae Youn Kim

Yiu-Hsiang Chang

Hong-goo Choi

Chouhwan Moon

Daniel Florian Acquard

Pei-Chen Chiang

A method for metallizing through-glass vias in a glass substrate includes functionalizing a surface of the glass substrate with a silane. The glass substrate has an average thickness t and comprises a plurality of vias extending through the thickness t. The method further includes applying an electroless plating solution comprising a copper ion to deposit a copper seed layer on the functionalized surface, disposing an electrolyte within the plurality of vias, wherein the electrolyte comprises copper ions to be deposited on the copper seed layer within the plurality of vias; positioning an electrode within the electrolyte; and applying a current between the electrode and the glass substrate, thereby reducing the copper ions into copper within the plurality of vias such that each of the plurality of vias is filled with copper and the copper has a void volume fraction of less than 5%.

Copper metallization for through-glass vias on thin glass

Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example a cationic polymer coating layer, and associated deposition methods, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (≤600° C.) processing while also preventing formation of a permanent bond between the sheets during such processing.

Temporary bonding using polycationic polymers

Display tiles comprising pixel elements on a first surface of a substrate connected by an electrode, a driver located opposite the first surface, and a connector wrapped around an edge surface of the substrate connecting the driver to the pixel elements. Displays comprised of display tiles and methods of manufacturing display tiles and displays are also disclosed.

Bezel-free display tile with edge-wrapped conductors and methods of manufacture

Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example a coating layer comprising a cationic surfactant or a coating layer comprising an organic salt, and associated deposition methods. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (? 500&#xb0; C.) processing while also preventing formation of a permanent bond between the sheets during such processing.

Temporary bonding of glass pairs using cationic surfactants and/or organic salts

A glass element having a thickness from 25 &#x3bc;m to 125 &#x3bc;m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress &#x3c3;I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Bendable glass stack assemblies, articles and methods of making the same

Growing community of inventors

Zhubei, Taiwan

Pei-Lien Tseng