Industrial Technology Research Institute

Pei-Jung Tsat

Chih-Hsiang Lin

Hsin-Ching Kao

Shu-Ling Yeh

Chin-Lang Wu

Ya-Lan Chuang

Cing-Jiuh Kang

A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode.

Method for packaging light emitting diode

The disclosed is a copolymer having a formula as: Ris a combination of naphthalene, phenylene, butyl, and hexyl. Ris a combination of ethylene, cyclohexlene, 2-methylpropyl, and neopentyl. n is a number of 1500 to 3000. The copolymer has a transparency greater than 80%, a thermal resistance greater than 100&#xb0; C., a moisture absorption less than 0.5 wt %, and yellowing under UV/climate resistance greater than 1000 hours.

Copolymer and method for manufacturing the same and packaging material utilizing the same

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Taichung County, Taiwan

Pei-Jung Tsat