Winbond Electronics Corporation

Pei-Hsiu Peng

Hung-Yu Wei

Wei-Che Chang

Kai Jen

Provided is a semiconductor structure including multiple pairs of target patterns, a first conductive line, and a second conductive line. Each of the pairs of target patterns includes a top pattern and a bottom pattern. The first conductive line is disposed on a first side of the pairs of target patterns. The first conductive line is electrically connected to a top pattern of a (aN+1)pair of target patterns in the pairs of target patterns, a is a fixed integer greater than or equal to 2, and N is an integer greater than or equal to 0. The second conductive line is disposed on a second side of the pairs of target patterns opposite to the first side. The second conductive line is electrically connected to a bottom pattern of the (aN+1)pair of target patterns in the pairs of target patterns.

Semiconductor structure

A multi-gate semiconductor structure and its manufacturing method are provided. The semiconductor structure includes a substrate having an active area and an isolation structure adjacent to the active area. The semiconductor structure includes a gate structure formed on the substrate and a gate dielectric layer between the gate structure and the substrate. The gate structure includes a first part above the top surface of the substrate and a second part connected to the first part. The second part of the gate structure is formed in the isolation structure, wherein the isolation structure is in direct contact with the bottom surface and sidewalls of the second part of the gate structure. A method of manufacturing the semiconductor structure includes partially etching the isolation structure to form a trench exposing the top portion of sidewalls of the substrate. The gate dielectric layer and the gate structure extend into the trench.

Multi-gate semiconductor structure and method of manufacturing the same

A dynamic random access memory (DRAM) and its manufacturing method are provided. The DRAM includes a buried word line, a bit line, a bit line contact structure, a capacitive contact structure, and an air gap structure. The buried word line is formed in the substrate and extends along a first direction. The bit line is formed on the substrate and extends along a second direction. The bit line contact structure is formed below the bit line. The capacitive contact structure is adjacent to the bit line and surrounded by the air gap structure. The air gap structure includes a first air gap and a second air gap respectively located on a first side and a second side of the capacitive contact structure. The first air gap exposes a shallow trench isolation structure in the substrate. The second air gap exposes a top surface of the substrate.

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Taichung, Taiwan

Pei-Hsiu Peng