Siliconware Precision Industries Co., Ltd.

Pei-Geng Weng

Chang-Fu Lin

Yuan-Hung Hsu

Don-Son Jiang

Fang-Lin Tsai

Yih-Jenn Jiang

Po-Yung Chang

Chi-Ren Chen

Wei-Son Tsai

Chia-Yu Kuo

A substrate structure is provided with a first electrical contact pad formed on an insulating layer of a substrate body, where the first electrical contact pad includes a first pad portion disposed on the insulating layer and at least one first protruding portion embedded in the insulating layer, so that the first pad portion is electrically connected to a circuit layer in the insulating layer by a conductive blind via, and the first protruding portion is free from being electrically connected to the circuit layer, such that, through a design of the first protruding portion, all surfaces of a metal layer formed on the insulating layer can meet the requirement of coplanarity.

Substrate structure

An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.

Electronic package and carrier thereof and method for manufacturing the same

An electronic package is provided, where a circuit layer and a metal layer having a plurality of openings are formed on a dielectric layer of a circuit portion to reduce the area ratio of the metal layer to the dielectric layer, so as to reduce stress concentration and prevent warping of the electronic package.

Electronic package and circuit structure thereof

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Taichung, Taiwan

Pei-Geng Weng