Wintek Corporation

Pei-Fang Tsai

Ming-Chuan Lin

Chun-Yi Wu

Shih-Cheng Wang

Wen-Hung Wang

Shyh-Jeng Chen

Chin-Mei Huang

Tsui-Chuan Wang

Hsueh-Chih Wu

Han-Chung Chen

Chi-Ming Huang

Wen-Yi Wang

A touch inductive unit includes a receiving electrode pattern and a driving electrode pattern. The receiving electrode pattern includes a first main stem, a first branch portion and a second branch portion. The first branch portion and the second branch portion are extended from the first main stem. The driving electrode pattern includes a second main stem, a third branch portion and a fourth branch portion. The third branch portion and the fourth branch portion are extended from the second main stem. The receiving electrode pattern and the driving electrode pattern are interdigitated and physically spaced apart from each other.

Touch inductive unit and touch panel

A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

Bonding pad structure

Growing community of inventors

Taichung, Taiwan

Pei-Fang Tsai