Taiwan Semiconductor Manufacturing Comp. Ltd.

Htc Corporation

Pei-Chun Tsai

Tin-Hao Kuo

Chen-Shien Chen

Sheng-Yu Wu

Hao-Yi Tsai

Wei-Sen Chang

Kuan-Wei Li

Shih-Lung Lin

Yu-Cheng Hung

Yu-Feng Chen

Yu-Chih Huang

Chih-Horng Chang

Shuo-Fang Jeng

Chung-Shi Liu

Ming-Da Cheng

Mirng-Ji Lii

Ching-Wen Hsiao

Sheng-Hsin Huang

Chita Chuang

Chien-Hsiun Lee

Yu-Jen Tseng

Sheng-Chieh Lin

Yu-Chu Lin

I-Chen Chen

Ching-Wen Fu

Ching-Yung Wu

Wei-Che Lin

Ching-Tzu Hung

A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a conductive pad formed over a substrate, and a conductive structure formed over the conductive pad. The conductive structure has a curved top surface. The semiconductor device structure also includes a protection layer between the conductive pad and the conductive structure. A lowest point of the curved top surface of the conductive structure is higher than a topmost surface of the protection layer.

Semiconductor structure with conductive structure

A method for forming a semiconductor device structure and method for forming the same are provided. The method includes forming a conductive pad over the substrate, and forming a protection layer over the conductive pad. The method also includes forming a conductive structure accessibly arranged through the protection layer and electrically connected to the conductive pad, and the conductive structure has a curved top surface. A lowest point of the curved top surface of the conductive structure is higher than a topmost surface of the protection layer.

A handheld apparatus, a control method thereof of a presenting mode and a computer-readable recording medium are provided. The handheld apparatus includes at least one first sensor, a second sensor, a screen and a processor. The first sensor is disposed on the handheld apparatus. The second sensor detects orientation. The handheld apparatus has an auto-rotate screen function of automatically adjusting a presenting mode of the screen to a portrait mode or a landscape mode according to the orientation. The processor determines whether the handheld apparatus is in a hold state according to sensing data of the first sensor. In response to determining that the handheld apparatus is in the hold state, the processor locks the presenting mode according to the presenting mode currently performed by the handheld apparatus without adjusting the presenting mode according to the auto-rotate screen function. Accordingly, a convenient operation of the presenting mode is provided.

Handheld apparatus, control method thereof of presenting mode and computer-readable recording medium

Display screen or portion thereof with graphical user interface

A method for operating a handheld device, a handheld device, and a computer-readable recording medium thereof are provided. A first and a second sensors are disposed on a first and a second side of the handheld device, respectively. A processor of the handheld device is configured to determine the handheld device is in a left hand state or a right hand state according to a compared result between sensing data of the first and second sensors, and to display an operating interface corresponding to the right or left hand state on a display, where the compared result includes a force comparison between forces applied on the first and second sides of the handheld device, the first side corresponds to the right hand state, and the second side corresponds to the left hand state. Accordingly, a better operating experience for one hand can be provided.

Method for operating handheld device, handheld device and computer-readable recording medium thereof

A method for operating a handheld device, a handheld device, and a computer-readable recording medium thereof are provided. The handheld device at least includes, but not limited to, a body, one or more sensors, a display, and a processor. The one or more sensors are disposed on at least one side of the body, respectively. The processor is coupled to the one or more sensors and the display and configured to receive an operation through the one or more sensors, determine a position of the operation on at least one side of the body according to sensing data generated by the sensors, and display a user interface corresponding to the position by the display. Accordingly, a convenient function for one hand operation is provided.

An image processing method, suitable for a mobile device including a camera unit and a display unit, includes separating a foreground portion and a background portion of a first image sensed by the camera unit, calculating a dimension of the foreground portion, generating an adjustment level in positively correlated with the dimension, applying an image effect at the adjustment level to the foreground or the background portion of the first image to generate a second image, and displaying the second image on the display unit.

Mobile device, and image processing method for mobile device

A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a substrate and a conductive pad formed over the substrate. The semiconductor device structure also includes a protection layer formed over the conductive pad, and the protection layer has a trench. The semiconductor device structure further includes a conductive structure accessibly arranged through the trench of the protection layer and electrically connected to the conductive pad. The conductive structure has a curved top surface that defines an apex, and an apex of the curved top surface is higher than a top surface of the protection layer.

A package component includes a dielectric layer and a metal pad over the dielectric layer. A plurality of openings is disposed in the metal pad. The first plurality of openings is separated from each other by portions of the metal pad, with the portions of the metal pad interconnected to form a continuous metal region.

Contact area design for solder bonding

An embodiment ladder bump structure includes an under bump metallurgy (UBM) feature supported by a substrate, a copper pillar mounted on the UBM feature, the copper pillar having a tapering curved profile, which has a larger bottom critical dimension (CD) than a top critical dimension (CD) in an embodiment, a metal cap mounted on the copper pillar, and a solder feature mounted on the metal cap.

Structures having a tapering curved profile and methods of making same

A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a substrate and a conductive pad formed over the substrate. The semiconductor device structure includes a protection layer formed over the conductive pad, and the protection layer has a trench. The semiconductor device structure includes a conductive structure formed in the trench and on the protection layer. The conductive structure is electrically connected to the conductive pad, and the conductive structure has a concave top surface, and the lowest point of the concave top surface is higher than the top surface of the protection layer.

Method for forming semiconductor structure

A package-on-package (PoP) comprises a substrate with a plurality of substrate traces, a first function chip on top of the substrate connected to the substrate by a plurality of bond-on-trace connections, and a second function chip on top of the first function chip, directly connected to the substrate. Another package-on-package (PoP) comprises: a substrate with a plurality of substrate traces, a first function chip on top of the substrate connected to the substrate by a plurality of solder mask defined (SMD) connections formed on SMD bonding pads connected to solder bumps, and a second function chip on top of the first function chip, directly connected to the substrate by a plurality of bond-on-trace connections.

Connecting function chips to a package to form package-on-package

A device is provided. The device may comprise an integrated circuit package. The integrated circuit package may comprise a first layer and a solder mask. The first layer may comprise a top surface wherein the solder mask is disposed on the top surface of the first layer. The solder mask may comprise a vertical edge. The vertical edge may form an angle between the top surface of the first layer and the vertical edge of not less than 90 degrees. The angle may be not less than 120 degrees or not less than 150 degrees.

Solder mask shape for BOT laminate packages

A structure comprises a substrate comprising a plurality of traces on top of the substrate, a plurality of connectors formed on a top surface of a semiconductor die, wherein the semiconductor die is formed on the substrate and coupled to the substrate through the plurality of connectors and a dummy metal structure formed at a corner of a top surface of the substrate, wherein the dummy metal structure has two discontinuous sections.

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Zhongli, Taiwan

Pei-Chun Tsai