Motorola Corporation

Peggy L Clark

Adolph C Naujoks

Juan O Alfonso

Ray D Pearson

A layout for a ball grid array (BGA) device ( ) includes a set of solder ball pads ( ) and a set of interconnection vias ( ). Each one of said the set of interconnection vias ( ) is coupled to a corresponding one of the solder ball pads ( ). The interconnection vias ( ) are laid out such that they provide for increased room for both vertical and horizontal traces ( and ). With the BGA device ( ) divided by an X-axis and a Y-axis to form four quadrants, two other axes V and W, are established rotated 45 degrees from the X and Y axes respectively. The solder pads ( ) and interconnection vias ( ) are on laid out on lines along or parallel to the V and W axes. The interconnection vias ( ) in the four quadrants are located closer to the edge margins of the BGA device ( ) than their corresponding solder ball pads ( ).

Layout for a ball grid array

A pivotable spring probe (30) includes a housing (36) having an opening, a plunger (34) within and guided by the housing, the plunger being slidingly movable between an extended position and a retracted position, a pivotable contact head (32) mounted on the plunger for making electrical contact with a conductive surface external to the housing, and a spring (42) mounted on the bottom of the plunger for biasing the plunger towards the housing opening.

Growing community of inventors

Plantation, FL, United States of America

Peggy L Clark