Honeywell International Inc.

Pedro Luis Lebron

Todd Loren Braman

Karthikeyan Paramanandam

Christopher Jay Matthews

Steven Edward Peter

Alejandro José Fernández

An electronic assembly comprises a printed circuit board including a plurality of stacked layers, wherein the stacked layers comprise a plurality of conductive layers, a plurality of dielectric layers respectively interposed between the conductive layers, and one or more phase change material layers interposed between at least one pair of the dielectric layers or at least one pair of the conductive layers. During a phase change, the one or more phase change material layers are configured to absorb thermal energy at a phase transition temperature to provide enhanced cooling of the printed circuit board. In some embodiments, the printed circuit board can be a metal core printed circuit board.

Printed circuit board assembly embedded thermal management system using phase change materials

Systems and methods for embedding electronics in a housing using additive manufacturing are provided. In certain embodiments, a system includes a housing made using an additive manufacturing process. The system also includes at least one electronics assembly that is embedded into the housing during the additive manufacturing process, wherein one or more electronic components on the at least one electronic assembly are isolated from the material used to form the housing. Further, the system includes an electrical connector coupled to at least one electronic component in the one or more electronic components, wherein the electrical connector provides an electrical connection between the at least one electronic assembly and system electronics that are outside the housing, wherein the electronic assembly is environmentally sealed within the housing from the environment outside the housing.

Embedding electronics in housing using additive manufacturing

A sensor assembly is disclosed. The sensor assembly includes a housing that includes a top housing and a bottom housing that clamp together. The sensor assembly also includes a printed circuit board assembly (PBA). The sensor assembly also includes at least one piece of elastic material that is located in between the top housing and the PBA and in between the bottom housing and the PBA. When the PBA is clamped in the housing, the sensor assembly allows the PBA to maintain alignment relative to the housing across different environments in order to enable proper operation of the sensor assembly. A top surface of the PBA and a bottom surface of the PBA each have at least one three-dimensional feature that is designed to increase friction with the elastic material.

Isolating sensor assembly using elastic material

Systems and methods for a printed circuit board assembly comprising a thermoelectric device at least partially embedded within the printed circuit board assembly are provided. The thermoelectric device is configured to adjust a temperature of the printed circuit board assembly based on the measurements of one or more sensors coupled to the printed circuit board assembly. Additionally, a control circuit is coupled to the at least one thermoelectric device and the one or more sensors, wherein the control circuit is configured to control the at least one thermoelectric device, and wherein the control circuit is configured to monitor a temperature set point at one or more target locations in the printed circuit board assembly.

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San Antonio, Puerto Rico

Pedro Luis Lebron