International Business Machines Corporation

Pedro A Chalco

Matthew F Cali

Laertis Economikos

Chandrasekhar Narayan

James L Speidell

Raymond R Horton

Bruce Kenneth Furman

Edmund D Blackshear

Paul Andrew Moskowitz

Carlos Juan Sambucetti

Steven Lorenz Wright

Michael John Brady

Michael J Palmer

Joseph Funari

Kevin Wilson Warren

Wesley LeRoy Hillman

Philip Murphy

Francois Guindon

John R Behun

Claude Blais

Joseph C Andreshak

Robert Lewis Rohr

Paul M Alt

J Robert Young

Richard H Kurth

Benal Lee Owens, Jr

Harry D Euler

Nicholas T Panousis

A matrix addressed display system designed so as to enable data line repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line repair utilizes additional data driver outputs, a defect map memory in the TFT/LCD module and modification of the data stream to the data drivers by additional circuits between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.

TFT LCD active data line repair

A method is provided for forming a solder joint to a pad, in which the thickness of the intermetallic layer formed by nickel in contact with solder is significantly reduced. A first layer of nickel is provided on the pad; a second layer of a noble metal (preferably gold) is then provided overlying the first layer. The first layer and the second layer are then annealed, thereby forming an alloy layer including nickel and the noble metal between the first layer and the second layer. Contacting the second layer with a molten solder (where the solder includes tin) then causes the noble metal to dissolve in the solder and the solder to subsequently wet the alloy layer, forming an intermetallic layer including nickel, the noble metal and tin. Only a thin intermetallic film grows, thus improving the reliability of the solder joint.

Nickel alloy films for reduced intermetallic formation in solder

A principle of surface interlocking wherein the imperfections of two parallel surfaces deform and interlock under pressure. The surface interlocking enables the combination of a bridging element and a bonding tip of a diffusion bonding apparatus to pick up, transport, position at a unique location, and bond the bridging element in place to the conductors or pads. In the invention a single point bonding tip as part of a bonding apparatus is used to pick up the, to be, bridging metal object transport it to the bonding site and perform the entire bridging bonding operation all in one sequence of steps.

Micro-scale part positioning by surface interlocking

Thin film diffusion bonding of lead assemblies under severly limited spacing, thermal and pressure conditions is achieved through application of precisely controlled energy at the bond interface. The precisely controlled energy is a laser thermosonic energy pulse, delivered through a cleaved optical fiber end and closed end tip, that produces a heat increment in excess of the steady state manufacturing design temperature for the assembly and which is applied directly at the bond interface.

Diffusion bonding of lead interconnections using precise

Manufacturing of a novel thin and flexible radio frequency (RF) tag with a stamped metal leadframe antenna is disclosed. The tag is made by transporting a leadframe strip having leadframe antenna 'cutouts' to a point where a chip is mechanically and electrically attached directly to the leadframe antenna. A battery can be attached to the chip in the process. Processes to cut support bars holding the leadframe antenna to the leadframe strip, seal the package (by lamination or molding), and to excise the sealed component are performed in various orders to produce a final product. Intermediate support (positioners) for the thin leadframe are optionally provided add structural support to the antenna while the sealed component is made. A protective surround can be added to cover the package and to provide further structural support for the package while still permitting the sealed component to be thin and flexible.

Method of making a thin radio frequency transponder

A laser head for simultaneously attaching solder balls to a carrier has at least one solder tip, with the number of solder tips being equal to the number of solder balls to be attached to the carrier. Each solder tip is heated by an optical fiber in thermal contact with the tip at one end of the fiber and coupled to a laser, preferably operating in the infrared wavelength range, at the other end of the fiber via a multiplexer coupling device. A spring is used in association with each solder tip to bias each solder tip to hold the carrier in contact with the solder balls. The tip absorbs the radiant energy as it exits the optical fiber, and the tip is heated. The laser and multiplexer permit precise control over the heat imparted to the tip, which in turn permits control of the amount of the solder ball that is reflowed.

Method and apparatus for soldering with a multiple tip and associated

A method for encapsulating a semiconductor chip. The method includes the steps of first positioning a chip over a laser-curing cavity, and then dispensing a predetermined amount of encapsulant over the chip. Sequential steps include synchronizing a firing of a laser pulse immediately after the dispensing step, and curing the encapsulant by conducting heat generated by the laser pulse, through the chip.

Semiconductor chip packaging method which heat cures an encapsulant

A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.

Applying conductive lines to integrated circuits

A combination of laser energy and ultrasonic energy is used for soldering an insulated wire to a pad located on a substrate. The combined laser energy and ultrasonic energy strips the insulation from the wire and solders the resulting bare wire to the pad. The method has particular use for soldering insulated wire to pads located on heat sensitive substrates or to pads located in close proximity to heat sensitive devices. A principal application is for soldering fine insulated wires for connecting a thin film magnetic head to a circuit carrier substrate.

Lasersonic soldering of fine insulated wires to heat-sensitive substrates

A temperature sensing device for accurately measuring the temperature of a microbonding device tip. The temperature sensing device consists of an array of thin-film thermocouples produced by thin-film patterning techniques on a substrate card. Each thermocouple is composed of two circuit lines of dissimilar metals A & B. The dissimilar metals are superimposed at a junction point. A third metal C is deposited between the metals A and B to prevent premature degradation of the thermocouple junction. A common line is used for one of the two metals connecting to the junctions. This allows almost twice as many thermocouples than conventional layout techniques.

Temperature sensing device for dynamically measuring temperature

A method and apparatus is disclosed for machining very fine, smooth cuts and grooves on minute surfaces such as single point bonding tips. The invention accurately aligns the axis of a reciprocating cutting wire in the direction of reciprocating motion and permits precise positioning and repositioning of the cutting wire on a work surface. The apparatus allows an unobstructed view of the wire in proximity to the workpiece during the alignment, positioning, repositioning, and cutting operations.

High precision micromachining of very fine features

Open defects in thin film conductor lines on a substrate are repaired by diffusion bonding a selected conductive repair line from a support sheet positioned over the open defect. The diffusion bonding is performed by the application of ultrasonic energy and laser energy.

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Yorktown Heights, NY, United States of America

Pedro A Chalco