Pimems, Inc.

University of California

Payam Bozorgi

Noel C MacDonald

Carl D Meinhart

Brian Piorek

Gaurav Soni

Changsong Ding

Shannon Gott

The present application discloses a microfabricated micron-scale battery having excellent performance attributes. The battery using a titanium anode which is etched to form a plurality of raised features on the titanium anode. The raised features are coated conformally with a highly conductive metal. A layer of titanium is then formed over the highly conductive metal. This titanium layer is then oxidized to provide further small scale roughness. The roughness increases the surface area which improves the uptake of lithium ions by the anode. The battery can be combined with a titanium thermal ground plane to further enhance performance by removing heat from the battery.

MEMS anode battery

The present application discloses two-phase cooling devices that may include at least three substrates, a metal with a wicking structure, an intermediate substrate, and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

High performance two-phase cooling apparatus for portable applications

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor chamber for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The intermediate substrate may form narrow channels within the wicking structure, providing high capillary forces to support large pressure differences between the liquid and vapor phases, while minimizing viscous losses of the liquid flowing in the wicking structure.

High performance two-phase cooling apparatus

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The intermediate substrate may form narrow channels within the wicking structure, providing high capillary forces to support large pressure differences between the liquid and vapor phases, while minimizing viscous losses of the liquid flowing in the wicking structure.

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages. The thermal module may also have a metal layer which may act as a shield for radiation or an antenna for radiation, or may add mechanical strength to the thermal module.

Titanium thermal module

Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.

Titanium-based thermal ground plane

A new packaging method for a wide range of MEMS for application on both the wafer and device scale. Titanium is used as the packaging material and both silicon and titanium MEMS devices are integrated on to a titanium substrate. A Nd:YAG pulsed laser is used to micro-weld the titanium cap to the substrate. A three-dimensional time dependent model of heat flow during laser beam welding is presented. The heat transfer and parametric design capabilities of COMSOL were employed for this purpose. Model calculations are compared and calibrated with experimental results of pulsed laser welds. The functionality and hermiticity of the proposed packaging was evaluated by packaging a self actuated Veeco Instrument AFM cantilever tip. The experimental measurements show that the resonance frequency and quality factor of the device stay the same before and after packaging and the applied technique has no effect on the device.

Growing community of inventors

Santa Barbara, CA, United States of America

Payam Bozorgi