Adeia Semiconductor Bonding Technologies Inc.

Pawel Mrozek

Cyprian Emeka Uzoh

Gaius Gillman Fountain, Jr

George Carlton Hudson

Belgacem Haba

Laura Wills Mirkarimi

Suhail Jaan Sadiq

Embodiments herein provide for fluidic cooling assemblies embedded within a device package and related manufacturing methods. In one embodiment, the integrated cooling assembly comprises a semiconductor device and a cold plate directly bonded to a backside of the semiconductor device. The first side of the cold plate includes coolant channels, and a second side of the cold plate comprises at least two openings, defined by opening sidewalls extending away from the second side and towards the first side. The cavity sidewalls and the coolant channels of the first side run in a first direction, the at least two openings on the second side run in a second direction different from the first direction and overlap with portions of the coolant channels on the first side to form a continuous aperture between the second side and the first side of the cold plate.

Cooling channel shape with substantially constant cross sectional area

Reliable hybrid bonded apparatuses are provided. An example process cleans nanoparticles from at least the smooth oxide top layer of a surface to be hybrid bonded after the surface has already been activated for the hybrid bonding. Conventionally, such an operation is discouraged. However, the example cleaning processes described herein increase the electrical reliability of microelectronic devices. Extraneous metal nanoparticles can enable undesirable current and signal leakage from finely spaced traces, especially at higher voltages with ultra-fine trace pitches. In the example process, the extraneous nanoparticles may be both physically removed and/or dissolved without detriment to the activated bonding surface.

Reliable hybrid bonded apparatus

A method of manufacturing a device package. The method comprises patterning a first substrate to form patterned regions comprising a thermal oxide layer. The method further comprises directly bonding the patterned regions of the first substrate to a second substrate to form a bonding interface. The bonded first and second substrates form an integrated cooling assembly comprising a coolant chamber volume. Portions of the first substrate exposed to the coolant chamber volume comprise a native oxide layer.

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San Jose, CA, United States of America

Pawel Mrozek