Namics Corporation

Berol Corporation

Em-tech, Inc.

Other

Saint-gobain Ceramics & Plastics, Inc.

Saint-gobain Performance Plastics Corporation

Diemat, Inc.

Pawel Czubarow

Toshiyuki Sato

Jean L Spencer

Philip Abraham Premysler

Yoshitaka Kamata

Anthony Nicholas Czubarow

Gwo S Swei

Raymond L Dietz

Maciej Patelka

David W House

David C DeCoster

Oh-Hun Kwon

Olivier Guiselin

Takayuki Fujita

Osamu Suzuki

Ilya L Rushkin

Akito Yoshii

Kazuyoshi Yamada

Tsutomu Masuko

Yukinari Abe

Masayoshi Otomo

Yoojeong Kim

Daisuke Hashimoto

Kaori Matsumura

Takashi Sakamoto

A porous carbon has an I/Iof 2.0 or more in a Raman spectrum measured by Raman spectroscopy with respect to the porous carbon wherein the Iis an accumulated intensity of a peak for G band around 1590 cm, and the Iis an accumulated intensity of a peak for D band around 1350 cm. The porous carbon has pores having a size of less than 1 μm. The porous carbon can be contained in a resin composition for producing a varistor element.

Porous carbon and resin composition

Methods of making various fibers are provided including co-axial fibers with oppositely doped cladding and core are provide; hollow core doped silicon carbide fibers are provided; and doubly clad PIN junction fibers are provided. Additionally methods are provided for forming direct PN junctions between oppositely doped fibers are provided. Various thermoelectric generators that incorporate the aforementioned fibers are provided.

Precursor derived semiconductor devices having PN junctions

Provided are a varistor forming paste, a cured product thereof, and a varistor, that can increase the degree of freedom in designing an electronic device, and can exhibit appropriate varistor characteristics. The varistor forming paste contains an epoxy resin (A), a curing agent (B), and a carbon aerogel (C).

Varistor forming paste, cured product thereof, and varistor

Disclosed is a thermoelectric generator including a heat source contact, a heat sink contact, and a plurality of co-axial fibers. Each of the co-axial fibers include a core and a cladding disposed about the core. The plurality of co-axial fibers extend from the heat source contact to the heat sink contact. Thermoelectric generators are disclosed including hollow core doped silicon carbide fibers and doubly clad PIN junction fibers. Methods for forming direct PN junctions between oppositely doped fibers are additionally disclosed.

Semiconductor with coaxial P-type and N-type material

Fiber based thermoelectric device

A resin composition which includes (A) an epoxy resin, (B) a curing agent, and (C) carbon nanotubes, wherein the carbon nanotubes contain therein semiconducting single-walled carbon nanotubes in an amount of 70% by weight or more. A cured product of a paste made from the resin composition can be used to form a varistor element.

Resin composition, paste for forming a varistor element, and varistor element

An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.

Underfill composition for encapsulating a bond line

Continuous ceramic (e.g., silicon carbide) nanofibers () which are optionally p or n type doped are manufactured by electrospinning a polymeric ceramic precursor to produce fine strands of polymeric ceramic precursor which are then pyrolized. The ceramic nanofibers may be used in a variety of applications not limited to reinforced composite materials (), thermoelectric generators () and high temperature particulate filters ().

Thermoelectric generator including nanofibers

A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.

Liquid epoxy resin composition for semiconductor encapsulation

Conductive compositions which are useful as thermally conductive compositions and may also be useful as electrically conductive compositions are provided. The compositions include a conductive particle constituent in combination with a sintering aid which can, for example be a compound of the same metal in the nanometal, an organo-metallic, a metalorganic salt, mercaptan and/or resinate. In some embodiments the conductive particles include a small amount of nanoscale (&#x3c;200 nm) particles. The compositions exhibit increased thermal conductivity.

Conductive composition

A composite material includes a polyimide matrix material and an exfoliated graphite material dispersed within the polyimide matrix material. The composite material exhibits a Thermal Stability Index of at least about 20 and has a particle distribution in which 90% of the particles have a particle size not greater than 500 micrometers.

Thermally stable composite material formed of polyimide

Adhesive paste of polymer resin, fugitive liquid and particulate filler with round edges provides improved performance characteristics.

Thermally enhanced electrically insulative adhesive paste

A composite material including a thermoplastic polymer matrix and a non-carbonaceous resistivity modifier dispersed in the thermoplastic polymer matrix. The composite material has a surface resistivity of about 1.0&#xd7;10ohm/sq to about 1.0&#xd7;10ohm/sq and at least a portion of a surface of the composite material has a surface roughness (Ra) not greater than about 500 nm.

Highly filled thermoplastic composites

Erasable inks are provided for use in a writing instruments. In one aspect, the inks include a solvent, and, dispersed in the solvent as a colorant, a pigment having a flake-like morphology, the ink being substantially free of other colorants.

Growing community of inventors

Wellesley, MA, United States of America

Pawel Czubarow