Cypress Semiconductor Corporation

Infineon Technologies LLC

Pawan Kishore Singh

Shivananda Shetty

Yoram Betser

Chun Chen

Amichai Givant

Amir Rochman

Tio Wei Neo

Giovanni Mazzeo

James Minsu Pak

Kuo-Tung Chang

Kuo Tung Chang

Yair Sofer

Yoav Yogev

Stefano Amato

Alexander Kushnarenko

Kobi Danon

Cindy Sun

Idan Koren

Jonas Neo

Systems, methods, and devices implement counters with fault tolerance and power loss protection. Systems include a non-volatile memory device that includes a first counter configured to store a first plurality of data values representing a plurality of count operations, and a second counter configured to store a second plurality of data values representing an initiation and a completion of each erase operation performed on the first counter. Systems also include control circuitry configured to generate a count value based on a current counter value of the first counter, a current counter value of the second counter, and at least one physical parameter of the first counter.

Continuous monotonic counter for memory devices

Systems, methods, and devices dynamically determine sensing levels for memory devices. Devices include nonvolatile memory cells included in a plurality of memory sectors, a plurality of static reference cells configured to represent a first reference value for distinguishing between memory states, and a plurality of dynamic reference cells configured to represent the first reference value after a designated amount of memory sector activity. Devices also include a comparator configured to be coupled to at least one memory cell of the plurality of memory cells and to at least two of the plurality of static reference cells and the plurality of dynamic reference cells, and further configured to determine a memory state of the at least one memory cell based, at least in part, on a second reference value determined by a combination of at least two of the plurality of static reference cells and the plurality of dynamic reference cells.

Dynamic sensing levels for nonvolatile memory devices

A non-volatile memory has an array of non-volatile memory cells, first reference word lines and second reference word lines, and sense amplifiers. The sense amplifiers read system data, that has been written to supplemental non-volatile memory cells of the first reference word lines, using comparison of the supplemental non-volatile memory cells of the first reference word lines to supplemental non-volatile memory cells of the second reference word lines. Status of erasure of the non-volatile memory cells of the array is determined based on reading the system data.

Erase power loss indicator (EPLI) implementation in flash memory device

Systems, methods, and devices include counters configured to implement count operations. Systems include non-volatile memory devices which include a first counter configured to store a first plurality of data values representing a plurality of count operations, and a second counter configured to store a second plurality of data values representing a number of erase operations applied to the first counter. Systems further include control circuitry configured to implement read, write, and erase operations for the first counter and the second counter, determine a partial count value based, at least in part, on a current value of the second counter and at least one physical parameter of the first counter, and generate a count value by adding the partial count value with a current value of the first counter. Such counters and control circuitry are immune data loss due to power loss events.

Techniques for suppression of program disturb in flash memory devices are described herein. In an example embodiment, a method for suppression of program disturb in a flash memory array is provided. The flash memory array comprises rows and columns of memory cells, where the memory cells in each row are coupled to a source line and to a select-gate (SG) line, and the memory cells in each column are coupled to a respective bit line (BL). During a program memory operation, a first voltage, of a selected SG line, and a second voltage, of an unselected BL, are regulated independently of a power supply voltage of the flash memory array, where the first voltage is regulated in a first range of 0.9V to 1.1V and the second voltage is regulated in a second range of 0.4V to 1.2V.

Suppression of program disturb with bit line and select gate voltage regulation

An example embodiment comprises a method for fabrication of a non-volatile memory (NVM) device. An isolation structure is formed in a substrate between first and second locations for first and second NVM cells. A common charge trapping layer is formed as a continuous structure over the substrate, where a first portion of the charge trapping layer is disposed directly over the isolation structure and second portions of the charge trapping layer are disposed directly over the first and second substrate locations. Nitrogen doping of the first portion of the charge trapping layer is performed, where after the nitrogen doping is performed the first portion of the charge trapping layer includes a higher nitrogen concentration than the second portions. The first and second NVM cells are then formed over the first and second substrate locations, where the first and second NVM cells include the second portions of the charge trapping layer.

Method of reducing charge loss in non-volatile memories

A non-volatile memory device and methods for operating the same are provided. The memory device may have multiple complementary memory cells. The method of blank check includes detecting a state value of each of the true and complementary transistors, generating an upper state value, Wherein a first predetermined amount of the true and complementary transistors have greater state values than the upper state value, generating a lower state value, wherein a second predetermined amount of the true and complementary transistors have less state values than the lower state value, generating a state value range based on a difference between the upper state value and the lower state value, and comparing the state value range to a threshold value to determine whether the plurality of complementary memory cells is in a blank state or a non-blank state. Other embodiments are also disclosed herein.

Non-volatile memory device and method of blank check

Techniques for suppression of program disturb in flash memory devices are described herein. In an example embodiment, an apparatus comprises a flash memory device coupled to a microprocessor. The flash memory device comprises rows and columns of memory cells, where the memory cells in each row are coupled to a source line and to a select-gate (SG) line, and the memory cells in each column are coupled to a respective bit line (BL). A control circuit in the flash memory device is configured to regulate both a first voltage, of a selected SG line, and a second voltage, of an unselected BL, independently of a power supply voltage of the flash memory device, and to adjust at least one of the first voltage and the second voltage based on a measure of an operating temperature of the flash memory device.

A memory apparatus that has at least two non-volatile memory (NVM) cells disposed side by side overlying a substrate and an isolation structure disposed between the first and second NVM cells in the substrate. The first and second NVM cells share a common charge trapping layer that includes a continuous structure, and the portion of the common charge trapping layer that is disposed directly above the isolation structure includes a higher oxygen and/or nitrogen concentration than the portions of the common charge trapping layer that are disposed within the first and second NVM cells.

Techniques for suppression of program disturb in memory devices are described herein. In an example embodiment, a memory device comprises a flash memory array coupled to a control circuit. The flash memory array comprises rows and columns of memory cells, where the memory cells in each row are coupled to a source line and to a select-gate (SG) line, and the memory cells in each column are coupled to a respective bit line (BL). The control circuit is configured to regulate both a first voltage, of a selected SG line, and a second voltage, of an unselected BL, independently of a power supply voltage of the flash memory array, and to adjust at least one of the first voltage and the second voltage based on a measure of an operating temperature of the memory device.

Growing community of inventors

Santa Clara, CA, United States of America

Pawan Kishore Singh