Motorola Corporation

Pavel Pesek

David W Currier

The assembly includes a heat-conductive plate onto which a pair of circuit modules are mounted, one module on each side of the plate. A continuous piece of flexible material, such as polyimide, forms the substrate for one circuit module, passes around an edge of the plate, and connects to the other circuit module for which it also forms the substrate. Conductors carried by the flexible material interconnect the modules and also connect the modules to external devices via a connector.

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Rolling Meadows, IL, United States of America

Pavel Pesek