Sitime Corporation

Apple Inc.

Sitime Corpoaration

Pavan Gupta

Markus Lutz

Aaron Partridge

Andrew W Joyce

Albert Lin

Martin Paul Grunthaner

Joseph C Doll

Teera Songatikamas

Collin R Petty

Adam Monkowski

Daniel J Bechstein

John R Matthews

Paul Xiaopeng Wang

Alex Joseph Lehmann

Nahid Harjee

Qiliang Xu

Brenton A Baugh

Blake R Marshall

Julian K Shutzberg

Wesley William Zuber

Hojjat Seyed Mousavi

Xiaofan Niu

Henry N Tsao

David Steven Graff

Mo Li

Benedict Drevniok

Eric Razda

Nathaniel M Parnell

A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

MEMS resonator integrated cicruit fabrication

MEMS resonator system

A stylus input device can allow a user to interface with an external electronic device. The stylus can provide an additional or alternative input to the external electronic device in response to a user applying a compressive force to the device housing. The stylus can include multiple sensors to provide a signal in response to the compressive force applied to the stylus.

Stylus with compressive force sensor

Stacked-die MEMS resonator

A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.

Microelectromechanical structure with bonded cover

A force transducer for an electronic device can be operated in a drive mode and a sense mode simultaneously. In particular, the force transducer can provide haptic output while simultaneously receiving force input from a user. The force transducer is primarily defined by a monolithic piezoelectric body, a ground electrode, a drive electrode, and a sense electrode. The ground electrode and the drive electrode each include multiple electrically-electrically conductive sheets that extend into the monolithic body; the electrically conductive sheets of the ground electrode and the drive electrode are interdigitally engaged. The sense electrode of the force transducer is typically disposed on an exterior surface of the monolithic body.

Force transducer for electronic devices

A compliant material, such as a conductive foam, is positioned in the dielectric or capacitive gap between drive and sense electrodes and/or other conductive elements of a capacitive and/or other force sensor, such as a TFT or other display element and a sensor assembly. The compliant material prevents damage by preventing and/or cushioning contact. The compliant material may be conductive. By being conductive and being positioned between the electrodes while still being separated from one or more of the electrodes, the compliant material also shortens the effective electrical distance between the electrodes. As a result, the force sensor may be more sensitive than would otherwise be possible while being less vulnerable to damage.

Compliant material for protecting capacitive force sensors and increasing capacitive sensitivity

Manufacturing of integrated circuit resonator

A device includes a housing defining part of an interior volume and an opening to the interior volume; a cover mounted to the housing to cover the opening and further define the interior volume; a display mounted within the interior volume and viewable through the cover; and a system in package (SiP) mounted within the interior volume. The SiP includes a self-capacitance sense pad adjacent a first surface of the SiP; a set of solder structures attached to a second surface of the SiP, the second surface opposite the first surface; and an IC coupled to the self-capacitance sense pad and configured to output, at one or more solder structures in the set of solder structures, a digital value related to a measured capacitance of the self-capacitance sense pad. The SiP is mounted within the interior volume with the first surface positioned closer to the cover than the second surface.

Force or touch sensing on a mobile device using capacitive or pressure sensing

Encapsulated microelectromechanical structure

Package structure for micromechanical resonator

In a MEMS device, an oxide layer is disposed between first and second semiconductor layers and MEMS resonator is formed within a cavity in the first semiconductor layer. A first electrically conductive feature functionally coupled to the MEMS resonator is exposed at a surface of the first semiconductor layer, and an insulating region is exposed at the surface of the first semiconductor layer adjacent the first electrically conductive feature. A semiconductor cover layer is bonded to the surface of the first semiconductor layer to hermetically seal the MEMS resonator within the cavity. A second electrically conductive feature extends through the semiconductor cover layer to contact the first electrically conductive feature, and an isolation trench extends through the semiconductor cover layer to the insulating region to electrically isolate a conductive path formed by the first and second electrically conductive features.

Low-profile stacked-die MEMS resonator system

Growing community of inventors

Belmont, CA, United States of America

Pavan Gupta