Asml Netherlands B.v.

Asml Holding N.v.

Paulus Antonius Andreas Teunissen

Ronald Franciscus Herman Hugers

Rene Marinus Gerardus Johan Queens

Patrick Sebastian Uebel

Sebastian Thomas Bauerschmidt

Peter Maximilian Götz

Andreas Johannes Antonius Brouns

Paul William Scholtes-Van Eijk

Vitaliy Prosyentsov

Edwin Johannes Cornelis Bos

Jan Adrianus Boer

Mahesh Upendra Ajgaonkar

Frank Staals

Hendrik Sabert

Petrus Johannes Maria Broodbakker

Arie Jeffrey Den Boef

Nitesh Pandey

Heine Melle Mulder

Gerrit Johannes Nijmeijer

Willem Richard Pongers

Roeland Nicolaas Maria Vanneer

Parag Vinayak Kelkar

Martinus Cornelis Reijnen

Robert Jan Van Wijk

Alexander Charles Franciscus Anna Van Well

Petra Albertina Margaretha Dekkers-Rog

Ronald Albert John Van Doorn

Peter Maximilian GÖTZ

A mode control system and method for controlling an output mode of a broadband radiation source including a photonic crystal fiber (PCF). The mode control system includes at least one detection unit configured to measure one or more parameters of radiation emitted from the broadband radiation source to generate measurement data, and a processing unit configured to evaluate mode purity of the radiation emitted from the broadband radiation source, from the measurement data. Based on the evaluation, the mode control system is configured to generate a control signal for optimization of one or more pump coupling conditions of the broadband radiation source. The one or more pump coupling conditions relate to the coupling of a pump laser beam with respect to a fiber core of the photonic crystal fiber.

Mode control of photonic crystal fiber based broadband radiation sources

A method for manufacturing a capillary usable as part of a hollow-core photonic crystal fiber. The method includes obtaining a capillary having capillary wall including a first wall thickness; and chemically etching the capillary wall to reduce the wall thickness of the capillary wall. During performance of the etching, a control parameter is locally varied along the length of the capillary, the control parameter relating to reactivity of an etchant used in the etching, so as to control the etched wall thickness of the capillary wall along the capillary length. Also disclosed is a capillary manufactured by such a method and various devices including such a capillary.

Method of manufacture of a capillary for a hollow-core photonic crystal fiber

A topography measurement system includes a radiation source; a first grating; imaging optics; a movement mechanism; detection optics; a second grating; and a detector. The radiation source is configured to generate a radiation beam and includes a light emitting diode to produce to the radiation. The first grating is configured to pattern the radiation beam. The imaging optics is configured to form a first image of the first grating at a target location on a substrate. The movement mechanism is operable to move the substrate relative to the image of the first grating such that the target location moves relative to the substrate. The detection optics is configured to receive radiation from the target location of the substrate and form an image of the first image at the second grating. The detector is configured to receive radiation transmitted through the second grating and produce an output signal.

Topography measurement system

A light combiner () for use in a metrology tool includes a plurality of light sources (LED, LED, LED, LED, LED), a first filter (), and a second filter (). The first filter is designed to substantially reflect light generated from a first source of the plurality of light sources, and to substantially transmit light generated from a second source of the plurality of light sources. The second filter is designed to substantially reflect light generated from the first source and the second source of the plurality of light sources, and to substantially transmit light generated from a third source of the plurality of light sources. An angle of incidence of the light generated from the first source on a surface of the first filter is less than 30 degrees.

Wavelength combining of multiple source

A topography measurement system comprising a radiation source configured to generate a radiation beam, a spatially coded grating configured to pattern the radiation beam and thereby provide a spatially coded radiation beam, optics configured to form an image of the spatially coded grating at a target location on a substrate, detection optics configured to receive radiation reflected from the target location of the substrate and form an image of the grating image at a second grating, and a detector configured to receive radiation transmitted through the second grating and produce an output signal.

A lithographic apparatus includes a level sensor for use in positioning a target portion of the substrate with respect to a focal plane of the projection system, a pair of actuators, configured to move a substrate table of the lithographic apparatus, and a controller for moving the substrate relative to the level sensor by controlling the actuators. The controller combines motions of the first and second actuators to produce a combined movement having a speed higher than a maximum speed of at least one of the actuators individually.

Method and lithographic apparatus for measuring and acquiring height data relating to a substrate surface

A level sensor for a lithographic projection apparatus according to one embodiment of the invention includes a light source, a first reflector, a second reflector and a detector. The first reflector is positioned to direct light from the light source towards a wafer surface, and the second reflector is positioned to direct light reflected from the wafer surface to the detector. The first and second reflectors are selected to incur a minimal process dependent apparent surface depression.

Lithographic apparatus, level sensor, method of inspection, device manufacturing method, and device manufactured thereby

A level sensor for a lithographic projection apparatus includes a light source configured to direct light onto a substrate to be measured, a detector configured to detect light reflected from the substrate, and a processor configured to calculate a difference between measurements made with the filter in the first configuration and in the second configuration. The sensor is adjustable between a first configuration, in which the light is given a first property, and a second configuration, in which the light is given a second property. The sensor may include a polarizing filter, such that the first and second properties are different polarization states.

Level sensor for lithographic apparatus

According to one embodiment, a method of calibrating level sensors of at least two lithographic projection apparatus to correct machine to machine level sensor process dependency includes using a first lithographic projection apparatus to measure a first set of leveling data for a reference substrate and a second set of leveling data for a substrate processed according to a selected process, and using a second lithographic projection apparatus to measure a third set of leveling data for the reference substrate and a fourth set of leveling data for the processed substrate. The method also includes calculating, based on the first, second, third and fourth sets of leveling data, a set of level sensor parameters corresponding to machine to machine level sensor differences for the selected process, wherein the machine to machine level sensor differences are measured and stored as intrafield values.

Lithographic apparatus, device manufacturing method, and device manufactured thereby

A method of calibrating level sensors of at least two lithographic projection apparatus to correct machine to machine level sensor process dependency includes measuring a first set of leveling data using a first lithographic projection apparatus for a reference substrate, measuring a second set of leveling data using the first apparatus for a substrate processed according to a selected process, measuring a third set of leveling data using the second apparatus for the reference substrate, measuring a fourth set of leveling data using the second apparatus for the processed substrate, and using the first, second, third and fourth sets of leveling data to calculate the set of level sensor parameters corresponding to machine to machine level sensor differences for the selected process.

Growing community of inventors

Eindhoven, Netherlands

Paulus Antonius Andreas Teunissen