Avago Technologies General IP (singapore) Pte. Ltd.

Foxconn Interconnect Technology Limited

Avago Technologies Fiber IP (singapore) Pte. Ltd

Avago Technologies Enterprise IP (singapore) Pte. Ltd.

Paul Yu

David J K Meadowcroft

Michael John Brosnan

David Meadowcroft

Andrew Engel

Omid Momtahan

Robert H Yi

Laurence Ray McColloch

Seng-Kum Chan

Klaus D Giessler

Klaus Giessler

Li Ding

Chung-Yi Su

Ronald T Kaneshiro

Xiaozhong Wang

Frank David Yashar

Chaitanya Arekar

Hui Xu

Robert G Ritter

Kit Cham

A transceiver printed circuit board (PCB) includes an integrated circuit (IC) with at least two different functionality, a photodiode and a laser. The IC has a first side, a second side opposite to the first side, a third side connecting the first side and the second side, and a fourth side opposite to the third side. The photodiode and the laser are both located in a first space beside the first side. The functionality of a transimpedance amplifier, a laser driver, and a clock and data recovery is integrated into the IC.

Layout of optical engine components and integrated circuits on a transceiver printed circuit board

An SFP transceiver with a die-casting metal housing and a metallic upper cover formed via sheet metal and assembled to the housing to commonly form therebetween a receiving cavity in which a printed circuit board assembly is received. The printed circuit board assembly includes an optical module with a lens structure, around a mating port, including a front face with a pair of tubular structures extending forwardly. A metallic EMI shielding device includes a plate with a pair of sleeves unitarily extending therefrom via a deep drawing method to cover the front face and the tubular structures, respectively. Each sleeve further includes a flange to cover a ring type front end face of the corresponding tubular structure in the front-to-back direction.

SFP transceiver equipped with deep drawn metal EMI sleeve around mating portion of lens module

A printed circuit board assembly comprises a printed circuit board (PCB) defining a mounting end and an opposite contacting end, a row of first pads on the mounting end, a row of second pads on the contacting end, and an edge connector on the contacting end electrically contacted with the second pads, and a high speed line module mounted on a top side of the PCB and including a group of conductive lines, the conductive lines extending parallel to each other over the plane of the PCB, each conductive line having two ends electrically connected to corresponding first and second pads, respectively.

Printed circuit board having improved high speed transmission lines

A parallel optical communications module includes a top lens and a bottom lens that are spaced from one another to inhibit mechanical forces acting upon the top lens from being transferred to the bottom lens, which is optically aligned with an opto-electronic light source or light detector. The top lens has a reflector portion configured to redirect the optical signals between the bottom lens and one or more optical fibers.

Parallel optical transceiver with top and bottom lenses

A mounting block is provided that has a multi-level upper surface that is used to mount one or more IC chips and the printed circuit board (PCB) thereon at heights that allow the lengths of the bond wires interconnecting the chips with the PCB and/or with the other IC chips to be reduced. The distances between the levels of the multi-level surface are preselected based at least in part on the known height of the PCB and the known height of at least one of the IC chips such that when the chip and the PCB are mounted on the mounting block, the distance between the contact pads of the PCB and the contact pads of the IC chip is very small, thereby allowing the lengths of the bond wires to be kept very short.

Mounting block and a mounting assembly that incorporates the mounting block

An optical assembly can be formed by providing a frame made of a plastic material on a surface of a printed circuit board (PCB), mounting at least one opto-electronic element on the surface of the PCB within the frame, and laser-welding a lens device onto the frame.

Lens device attachment to printed circuit board

An optical communications module includes a housing that accommodates at least one optical receptacle having a cylindrical connector portion. The module further includes at least one deformable constraining member made of a material having a Young's modulus that allows the deformable constraining member to take on an initial deformity upon application of a compression force, but permits only a partial reversal of the deformity upon reduction or removal of the compression force. The initial deformity is created when the deformable constraining member is pressed against the cylindrical connector portion during assembly of the module. The initial deformity includes a deformed contour portion that conforms to at least a part of the cylindrical connector portion of the optical receptacle and prevents wiggling of the cylindrical connector portion after the cylindrical connector portion is pushed during assembly into an alignment notch provided in a lower housing portion of the module.

Optical communications module incorporating a deformable constraining member for constraining an optical receptacle

In an opto-electronic system having one or more optical transceiver modules and an enclosure, air is forced through the interior of the transceiver module to dissipate heat generated by the opto-electronic and electronic elements.

Air-cooled optical transceiver module system

A flexible dust cover is provided for use with a parallel optical communications module for preventing airborne matter, such as dirt, dust, and gases from entering the module. The flexible dust cover fits snugly to the module to protect components of the module and the optical pathways of the module from airborne matter. The flexible dust cover has an elasticity that allows it to be temporarily deformed from its original shape to a stretched state by application of a stretching force to enable the module to be inserted into a central opening formed in the cover. The force is then removed, causing the cover to attempt to return to its original, non-stretched shape. When this happens, interior surfaces of the cover form a snug fit about exterior surfaces of the module. This snug fit fills in air gaps in the module that would otherwise be exposed to the environment.

Flexible dust cover for use with a parallel optical communications module to prevent airborne matter from entering the module, and a method

An optical transceiver module is provided with an elongated delatching pull tab that that enables an optical transceiver module to be easily delatched and pulled from a cage without having to first unplug optical fiber cables from the module and without having to rotate a bail. Thus, the number of manual actions that need to be performed by a user to remove the module from a cage is drastically reduced, which makes simplifies the removal process and makes the design well suited for use in hot-pluggable environments. In addition, the delatching pull tab obviates the need for pins or screws, thereby improving manufacturing yield by reducing the likelihood that the module will be damaged during the manufacturing process. In addition, by eliminating pins or screws and a bail from the design, there are fewer moving parts that can wear out over time.

Optical transceiver module equipped with an elongated delatching pull tab, and a method

An opto-electronic communication module includes a housing, an electro-optical assembly, and a retainer that helps maintain alignment of an optical port. The electro-optical assembly includes a circuit substrate, an opto-electronic communication device mounted on the circuit substrate, and an optics module having an optical connection portion extending into the opening of the housing to define the optical port. The retainer can be, for example, a clip that contacts the housing and fits over the optical connection portion of the optics module to maintain the optical connection portion in alignment with the opening of the housing.

Opto-electronic communication module having retainer for aligning optical ports

A heat dissipation solution is provided that includes a heat sink structure that has a very high thermal conductivity and includes elements or features that can be deformed to increase the contact surface areas between the heat sink structure and the module casing, thereby decreasing thermal resistance. By increasing the thermal conductivity and the sizes of the surface areas that are used for transferring heat, the temperature difference between the temperature of the light source and the temperature of the module casing can be decreased to enable the light source to be operated at higher data rates. Furthermore, deformation of the deformable features also removes space between the optical subassembly and the module body caused by mechanical tolerance differences that occur during manufacturing.

Optical transceiver module having a deformable heat sink structure

Systems and methods for balanced cooling of electrical systems, including electrical systems containing transceivers used in electrical and optical communication. An electrical system includes a cage, where the cage has a top, front and bottom. The cage contains a plurality of upper bays disposed in the front of the cage. Each of the plurality of upper bays is configured to receive a transceiver. The cage also contains a plurality of lower bays disposed in the front of the cage. Each of the lower bays is configured to receive a transceiver. Additionally, each of the plurality of upper bays is stacked on one of the plurality of lower bays. An upper heat sink extends from the outer surface of the top of the cage and a lower heat sink extends from the outer surface of the bottom of the cage.

Balanced cooling system and method for high-density stacked cages

Systems and methods for direct cooling of transceivers, including transceivers used in electrical and optical communications systems. An electrical system includes a transceiver module with a housing that contains a plurality of apertures to allow air flow into and out of the transceiver module. The transceiver includes an internal heat sink located within the housing of the transceiver module, where the internal heat sink is thermally coupled to at least one internal component of the transceiver module. The electrical system also includes a cage for receiving and electrically connecting to the transceiver module. The cage contains a second set of apertures such that when the transceiver module is inserted into the cage, air may flow into the cage through the second set of apertures, then flow into the transceiver module through one of the plurality of apertures in the transceiver module housing such that the air dissipates heat from the at least one internal component thermally coupled to the internal heat sink. The air may then flow out of the transceiver module through another of the plurality of apertures in the housing.

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Mountain View, CA, United States of America

Paul Yu