Akzo America Inc.

Akzo N.v.

Paul Y Moy

William J Parr

Dieter Frank

Ronald E Hutton

Arthur G Mack

David A Strawser

A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.

Conductive metal-filled substrates via developing agents

Conductive metal-filled composites via developing agents

A conductive metal layer is formed on a substrate by depositing copper or nickel particles on the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The coated substrates have conductive surfaces and are useful for a variety of uses such as EMI shielding and printed circuit boards.

Conductive metallization of substrates via developing agents

A flame resistant composition has (1) an organic polymeric substance (such as polypropylene) in intimate contact with (2) an ether, ester, or carbonate derivative of a bicyclic phosphorous compound (such as pentaerythritol phosphate) and (3) a gas producing compound (such as melamine or ammonium polyphosphate).

Bicyclic phosphate ether, ester, and carbonate intumescent flame

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Des Plaines, IL, United States of America

Paul Y Moy