Bae Systems Information and Electronic Systems Integration Inc.

Paul W Schoeck

Michael E Deflumere

Michael E DeFlumere

Joseph M Schlupf

A microchannel plate based optical communication receiving system and method of use for extracting embedded information from a covert band of modulated light. The system includes an electrically powered microchannel plate, a sense amplifier in electrical communication with the microchannel plate configured to sense a change in current across a sense resister, a demodulator in electrical communication with the sense amplifier to demodulate the band of modulated light, a data output signal exiting from the demodulator, and a receiver for receiving the data output signal and extracting a piece of covert information.

Microchannel plate based optical communication receiver system

Techniques are disclosed for improving the quantum efficiency of photocathode devices. The techniques allow for an increase in the optical thickness of the photocathode device, while simultaneously allowing for an increase in the probability of electron escape into the vacuum of the device. The techniques are particularly useful in detector and imaging. In one embodiment, a photocathode device is provided that has an array of corner cubes fabricated in a surface of the photocathode. The corner cube array is made of the same material as the photocathode layer. The device may be, for example, a detector or image intensifier that operates in the UV, visible, and IR light spectrums, and may further include a gain medium, anode, and readout device. Techniques for forming the device are also provided.

Corner cube enhanced photocathode

Techniques are disclosed that can be used to interface a sensor circuit with readout circuitry. The techniques can be employed, for instance, with microchannel plate (MCP) based devices used in numerous sensing/detection applications, and are particularly suitable for applications where it is desirable to interface an MCP having a relatively large active area to a readout circuit having a relatively smaller active area. The interface effectively decouples anode geometry from readout circuit geometry and also may be configured with flexible anode pad geometry, which allows for compensation of optical blur variations as well as a very high fill factor. The interface can be made using standard semiconductor materials and photolithography techniques and can be configured with thermal expansion qualities that closely track or otherwise match that of the readout circuitry.

Interface techniques for coupling a sensor to a readout circuit

Techniques are disclosed that can be used to increase the dynamic range of a microchannel plate (MCP) device, thereby eliminating the need for conventional techniques such as gating. In one example embodiment, an MCP device is provided that includes a plurality of channels, each channel for amplifying a photoelectron input to the channel and for producing an electron cloud at its output. The device further includes one or more charging switches associated with each channel for allowing charging current to flow so as to charge that channel in response to producing an electron cloud. In some such example cases, the plurality of channels and the one or more switches are implemented in silicon, and the one or more charging switches turn on only in the presence of the electron cloud produced at the corresponding channel output.

Selective channel charging for microchannel plate

Techniques are disclosed that can be used to interface a microchannel plate (MCP) with readout circuitry. The techniques can be employed, for instance, with MCP based devices used in a numerous sensing/detection applications, and are particularly suitable for applications where it is desirable to interface an MCP having a relatively large active area to a readout circuit having a relatively smaller active area. The interface effectively decouples anode geometry from ROIC geometry and may also be configured with flexible anode pad geometry, which allows for compensation of optical blur variations as well as a very high fill factor. The interface can be made using standard semiconductor materials and photolithography techniques, and can be configured with thermal expansion qualities that closely track or otherwise match that of the readout circuitry.

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Townsend, MA, United States of America

Paul W Schoeck