Lexmark International, Inc.

International Business Machines Corporation

Funai Electric Company Ltd.

Other

Paul W Graf

Kristi Maggard Rowe

George Keith Parish

John Glenn Edelen

Jiandong Fang

Mark K DeMoor

Frank Edward Anderson

Jonathan James Hurd

Yimin Guan

Carl Edmond Sullivan

Andrew McNees

Paul Timothy Spivey

David Golman King

Christopher Dane Jones

Steven Wayne Bergstedt

Matthew Joe Russell

Kent Lee Ubellacker

Thomas Austin Fields

Stephen F Newton

Donald J Ashley

Timothy Lorn Howard

David R Thomas

John Richard Fowler

Robert Edward Miller, Jr

John C Cassani

Rick L Hubert

Disclosed is a fluid ejection device for an inkjet printer that includes a substrate. The substrate includes at least one trench and a plurality of fluid flow vias configured in at least three parallel rows arranged over each trench of the at least one trench. Each row of the at least three parallel rows includes a set of fluid flow vias from the plurality of fluid flow vias arranged in one of a uniform manner and a non-uniform manner such that each fluid flow via of the set of fluid flow vias is configured in a spaced-apart relation with an adjacent fluid flow via. The each fluid flow via is configured in a diagonal relationship relative to a neighboring fluid flow via of an adjacent row of the at least three parallel rows. The fluid ejection device also includes a flow feature layer and a nozzle plate.

Fluid ejection devices

A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged adjacently along corresponding ones of fluid vias skewed variously or not to enable seamless stitching of printed images from the adjacent firing elements. The firing elements are energized to eject fluid and individual ones are spaced according to colors or fluid types. Overlapping firing elements serve redundancy efforts during imaging for reliable print quality. Variable chips sizes and shapes, including chevrons, are disclosed as are relationships between differently colored fluid vias. Skew angles range variously each with noted advantages. Bond pads and overlying encapsulation materials are still other features as are metallization lines for distributing power to ones of firing elements. Singulating chips from larger wafers provide still further embodiments as does increased usage of the wafer.

Partitioned array ejection chips for micro-fluid applications

Disclosed is an inkjet printhead that includes a plurality of fluid ejecting chips arranged in a plurality of rows. The plurality of fluid ejecting chips includes a first set of fluid ejecting chips arranged in a first row of the plurality of rows. The plurality of fluid ejecting chips includes a second set of fluid ejecting chips arranged in a second row parallel to the first row of the plurality of rows. Each fluid ejecting chip of the second set of fluid ejecting chips is configured between two consecutive fluid ejecting chips of the first set of fluid ejecting chips in a predetermined orientation. The inkjet printhead further includes a plurality of fluid vias and a plurality of bond pads. Further disclosed are fluid ejecting chips for being used in an inkjet printhead.

Inkjet printheads and fluid ejecting chips

A method of error detection in an inkjet printing apparatus having a host coupled to a print head. The method comprises the acts of communicating a first data stream between the host and the print head, inserting a reference data stream into the first data stream, and validating the first data stream based on the reference data stream.

Inkjet print head synchronous serial output for data integrity

Test circuits on heater chips for testing a heater circuit having a heater element and a first power device. The test circuit can include a second power device, a test device configured to hold the first power device off and the second power device on for a selected heater circuit when the test device receives a signal to activate the test circuit, and a common test output to transmit a signal indicative of a state of the selected heater circuit. Methods for using the same are also provided.

Heater chip test circuit and methods for using the same

A memory circuit for an inkjet print head having a plurality of memory cells switchably connected to a source and configured in an array, wherein at least one of the memory cells is a reference memory cell and at least one of the remaining cells are data memory cells, and at least one sense amplifier adapted to compare at least one of a current and voltage received from the reference memory cell with at least one of a current and voltage received from one of the data memory cells and generate an output based on the comparison.

Distributed programmed memory cells used as memory reference currents

An improved heater chip for an ink jet print head, the chip including an active heater array and an inactive heater array located adjacent to and extending away from the end of the active heater array. The inactive heater array provides a region adjacent the end of the active heater array that is substantially planar, and also provides a plurality of current paths which reduces energy differences between heater resistors adjacent the end of the active heater array and other heater resistors in the heater array.

Printheads having improved heater chip construction

A low-profile ink jet cartridge assembly for an ink jet printer. The low profile ink jet cartridge assembly includes a substantially rectangular ink jet cartridge body having a printhead side, opposing side surfaces attached to the printhead side and a length, a height, and a width, wherein the length is greater than the height and the width. A printhead containing a semiconductor substrate is attached to the printhead side of the ink cartridge. A flexible circuit having a width, a length, a first edge along the length thereof, a second edge along the length thereof, first printer contact pads along at least a portion of the length thereof adjacent the first edge, and second printer contact pads along at least a portion of the length thereof adjacent the second edge is attached to the ink cartridge on the opposing side surfaces of the cartridge body.

Low profile ink jet cartridge assembly

A thermal ink jet printing apparatus maintains stable printing output as certain characteristics of the apparatus change over its operational lifetime. The apparatus includes an ink jet print head with resistive heating elements for receiving electrical energy pulses having a voltage level and for transferring heat energy pulses having a desired energy level into adjacent ink based on the electrical energy pulses. The print head includes nozzles associated with the resistive heating elements through which droplets of the ink are ejected when the heat energy pulses are transferred into the ink. The apparatus further includes a printer controller in electrical communication with the print head. The printer controller determines a pulse count indicative of a number of electrical energy pulses, applies the electrical energy pulses having a first pulse width to the resistive heating elements when the pulse count is less than a threshold value, and applies the electrical energy pulses having an adjusted pulse width to the resistive heating elements when the pulse count exceeds the threshold value. The difference in the first and the adjusted pulse widths compensates for changes in the electrical resistance of the resistive heating elements over time.

Long-life stable-jetting thermal ink jet printer

A circuit compares a difference between first and second voltages to a predetermined voltage. The circuit comprises an amplifier having first and second inputs. First and second capacitors are each coupled at one end to the first input of the amplifier. The first capacitor is charged with the first voltage and subsequently discharged. The second capacitor is charged with a first reference voltage and subsequently discharged. Third and fourth capacitors are each coupled at one end to the second input of the amplifier. The third capacitor is charged with the second voltage and subsequently discharged. The fourth capacitor is charged with a second reference voltage and subsequently discharged.

Voltage comparison circuit

A temperature compensated control circuit includes a load transistor which passes the load current and has an on-resistance which varies with temperature. To provide temperature compensation, first and second pilot transistors are integrated with the load transistor such that as the load transistor heats-up due to the load current passing through the on-resistance of the load transistor, the first and second pilot transistors heat-up due to heat conduction from the load transistor. Each of the pilot transistors has an on-resistance which varies proportionally or similarly to the on-resistance of the load transistor. A first current source supplies a first level of current to the on-resistance of the first pilot transistor to develop a first reference voltage, and a second current source supplies a second level of current to the on-resistance of the second pilot transistor to develop a second reference voltage. The range between the first and second reference voltages corresponds to an acceptable range of load current. A voltage corresponding to the load current is sensed across the load transistor, and the control circuit controls the load current to maintain the sensed voltage within the range.

Temperature compensated circuit for controlling load current

A latch (29) is set by a clock (33) to turn on power switch (FET 5). The latch (29) is reset by high voltage comparator (21), by a 50 percent clock delay (35) and by a low-voltage-to-charging-current comparator (19). The voltage at turn-on is compared with a up-ramping reference (15) until it equals an operating reference (17). A temporary delay (pulse circuit 39 and gate 37) is provided before the low voltage comparison can be effective. The delay prevents response to parasitic effects across the power switch (5). Excess drive is prevented resulting from low output currents and malfunctions, and at turn-on.

Growing community of inventors

Lexington, KY, United States of America

Paul W Graf